From World Lasers, Inc.

The Night and Day marking application, also known as paint removal, is a very demanding application in various industries such as in the design of a car's interior. Research is continuously carried out into improving the cockpit environment for a car's occupants. The effective nighttime illumination and daytime aesthetics of a car's interior are becoming more important (see Figure 4 and 5). Switches and panels can be painted and lit in a variety of colours and use is being made of halo lighting and concealed graphics that only appear when illuminated. As people become accustomed to smaller buttons, steering wheels are being designed to include more of the controls for incar entertainment, phones and cruise control.

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Product Announcements
MTI Instruments Inc. - Wafer Measurement System from MTI Instruments
Proforma 200SA - Semi-automated, full wafer surface scanning for thickness, TTV, bow, warp, site and global flatness measurements. The Proforma 200SA can be used for most wafer materials and... (read more)
MTI Instruments Inc. - Wafer Metrology Measurement Tool
An alternative to fully automaed metrology tool, the Proforma 300SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Capable of handling... (read more)
MTI Instruments Inc. - Semiconductor Wafer Thickness Gage
Proforma 300/G - Manual, non-contact measurement system for wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures most wafer materials including Silicon,... (read more)
MTI Instruments Inc. - Solar Wafer Thickness Tool from MTI
Solar Wafer Thickness Tool from MTI. The PV-1000 is a High speed, multi-channel thickness, TTV and bow measurement module for in-process monitoring of solar/photovoltaic wafers and other materials. (read more)
MTI Instruments Inc. - Capacitance Displacement Sensor
The Accumeasure 9000 is a compact single or dual channel capacitance based position, displacement and vibration sensor with nanometer accuracy. The 9000D provides the same features as the 9000, but... (read more)
MicroSense, LLC - Non-Contact CD Stamper Thickness Measurement
A new model with higher measurement resolution, the Model 6360-CD-HR stamper thickness measurement system is a semi-automated thickness gauging platform and data analysis system for the measurement of... (read more)
SUSS MicroTec - SB6/8e Semi-Automated Wafer Bonding System
Precision Wafer Bonding Solution The SB6/8e is a semi-automatic, computer controlled, stand-alone wafer bonder accommodating 150mm and 200mm wafers respectively. The SB6/8e system features a rigid... (read more)
MTI Instruments Inc. - Laser Sensor Displacement & Position Measurements
Laser Sensor Displacement & Position Measurements from MTI Instruments. The Microtrak II features state-of-the-art CMOS laser triangulation sensing technology for precise measurements of... (read more)

Topics of Interest

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Three new ion implanters are available in the single-wafer VIISta platform. All three tools—the high-current 80HP, the medium-current 810EHP, and the high-energy 3000HP—have a throughput...

The WaferMark FOUP system for marking 300-mm wafers uses laser technology to place permanent, highly readable marks on wafers to allow wafer traceability. The tool features an ultrastable diode-pumped...

The Dynamic MEMS measurement option for the Wyko NT1100 optical profiler provides 3-D characterization of microdevices as they actuate, enabling the assessment of true device functionality and...