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Lead-free or die

 

 
Lead-alloy solder will soon be banned from most electronics sold in Europe. Assemblers and PCB makers are learning how to cope. studied how lead-free solders would work with its surface-mounted components. One study concerned a leadframe finish comprised of four layers of nickel and palladium. TI had previously used a thin layer of lead to protect the underlying pure nickel layer from oxidation. Use of a lead-free finish changed the contact angle of solder. At top is an artist's depiction of an SOIC lead cross section finished with tin-lead. Below is an SOIC finished with nickel-palladium. Both cases use Castin lead-free solder paste. TI says the higher contact angle proved to be only a cosmetic issue and didn't change the mechanical strength or reliability of the joints. An example developed by the National Electronics Manufacturing Center of Excellence depicts the diference in wetting properties of leaded and lead-free solder as defined by contact

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PCB pins and PCB receptacles are electronic interconnect devices for printed circuit boards (PCB). PCB pins are male connectors. PCB receptacles are female connectors. Search by Specification | Learn more about PCB Pins and Receptacles
Solders include low melting point metal alloys usually in wire, powder, preform or paste forms. Solders are metal alloys with low melting points that are used to join metals together. Search by Specification | Learn more about Solder
Battery charger ICs are integrated circuits (IC) that are used to charge batteries. Search by Specification | Learn more about Battery Chargers IC
Surface mount technology (SMT) manufacturing equipment is used to populate printed circuit boards (PCB). This includes soldering machines, ovens, component placement, paste depositors and screen and stencils. Learn more about SMT Manufacturing Equipment
Lead, tin and low melting alloys are non-ferrous alloys used in the manufacture of solders, semiconductors, batteries, optical and decorative products. Search by Specification | Learn more about Lead, Tin and Low Melting Alloys

Product Announcements
S-Bond Technologies LLC - New Solder for Like & Dissimilar Materials
S-Bond Technologies' Active Solder alloys are modifications of conventional solder alloys that wet and bond without the use of flux. All are lead and cadmium free. They are uniquely suited for bonding... (read more)
EFD, Inc. - EFD® No-drip Solder Paste
EFD's new SAC305 solder paste is a lead-free, no-clean formulation that is excellent for gap filling and application on vertical surfaces. (read more)
Paradigm Contract Manufacturing LLC - Printed Circuit Board Assembly
Located in Orange County, CA. We are a full-service EMS company specializing in: Printed Circuit Board Assemblies (leaded & lead-free); Cable Assemblies; Mechanical Assemblies; Box Build Projects;... (read more)
EFD, Inc. - Colorless No Clean Flux with Anti-slump Features
Colorless no-clean flux for use in EFD®'s PrintPlus® and SolderPlus® solder paste product lines. (read more)
Metallic Resources, Inc. - Tin/Lead Bar Solder
Metallic Resources' standard bar solder is manufactured from electrolytically processed tin and lead to create solder so pure it far exceeds the most common specification requirements. (read more)
Bellman-Melcor LLC - Bellman-Melcor's Soft Solder Alloys and Fluxes
Used for centuries as a means of joining metals together, solders are ideal for lower temperature applications. Since their founding in 1963, Bellman-Melcor has been providing the highest quality... (read more)
Metallic Resources, Inc. - Lead Free Bar Solder
Metallic Resources' lead free bar solders are manufactured from electrolytically processed tin and other elements to create solder so pure it far exceeds most specifications. All common industry... (read more)
 

Topics of Interest
14.9 Ni/Pd(X) ELECTROLYTIC Ni/PdCo/Au FLASH This surface finish, developed by Lucent Technology, is composed of a 100- in nickel bottom layer, a 10- in 80Pd-20Co (w/w) middle layer, and a 2-... (Read More)
The first step in choosing a solder is to decide what metals are going to be bonded, because the type of metal used will greatly influence the type of solder used. Soft solders are often used with... (Read More)
Lead-free solders are said to cause various problems, such as: lack of self-alignment, bridges, solder balls, insufficient wetting, dendrites, pits, voids and peeling of soldering land. (Read More)
PCA Electronics is ready to supply components that are in compliance with the EU RoHS Directive (EU Directive 2002/95/EC). PCA defines "RoHS Compliant" or "Pb-Free" to mean products that are compliant... (Read More)
2.1 INTRODUCTION Alternative material systems for lead-free solders1 71 are currently of intense interest in the electronics industry. This is initiated in part by the Waste Electrical and... (Read More)