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FE software targets complex multiphysics

 

 
Finite-element-software Comsol Multiphysics 3.3 allows simulating a wide variety of physical phenomena. An analysis of heat transfer in a V-Twin motorcycle engine block shows the surface temperature distribution in degrees Kelvin. The PDE Coefficient Form, one of Comsol's most flexible methods for solving a PDE, is being implemented to solve a problem with Fluid-Structural Interaction (FSI). The red lines indicate particle traces for the fluid flow. Finite-element-software Comsol Multiphysics 3.3 allows simulating a wide variety of physical phenomena. In fact, the program can model just about anything that can be described mathematically. It includes equations for some of the most common problems such as stress analysis, fluid transport, heat transfer, and mass diffusion. Users can also type in the governing partial differential equations (PDEs) for problems that describe phenomena not already included in the software. What really sets 3.3 apart, however, is that it allows coupling various equations together to solve multiphysics problems. A simple example comes from a problem involving thermal-induced stresses in a machine part. A more complex example is a hydrogen-fuel cell, which involves simultaneous mass transport by way of diffusion, fluid flow, and electrochemical reactions. Users can quickly modify governing PDEs to suit their needs. For example, after learning how to do a simple conduction heat-transfer analysis, a user can, in a matter of minutes, modify the equations to account for spatial and time-varying thermal conductivity throughout the part. All it takes is simply specifying a mathematical function to describe the parameter's variation. Many FE programs do not have this feature. Comsol is flexible enough to model just about everything from the deformation of nonlinear material to species distribution and concentration in a stirred reactor vessel. The program's graphical environment lets users model 2D or 3D geometry, mesh it, apply boundary conditions, and solve the problem. It's

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Product Announcements
COMSOL, Inc. - Multiphysics® Simulation Environment
The COMSOL Multiphysics® simulation environment facilitates all steps in the modeling process —defining your geometry, specifying your physics, meshing, solving and then post-processing your... (read more)
COMSOL, Inc. - Chemical Engineering Module
Based on the classic work Transport Phenomena by Bird, Stewart, and Lightfoot, the Chemical Engineering Module is the perfect tool for process-related modeling. It is specifically designed to easily... (read more)
COMSOL, Inc. - Structural Mechanics Module
This module is specialized in the analysis of components and subsystems where it is necessary to evaluate structural deformations. It also contains special application modes for the modeling of... (read more)
COMSOL, Inc. - Heat Transfer Module
Problems involving any combination of conduction, convection, and radiation are solved easily with the Heat Transfer Module. It finds extensive use in systems that involve the generation and flow of... (read more)
COMSOL, Inc. - Optimization Lab
The Optimization Lab provides a state-of-the-art solver for a broad range of multiphysics optimization problems in combination with COMSOL Multiphysics and its modules. Using the new Optimization... (read more)
COMSOL, Inc. - RF Module
Modeling in RF, microwave and optical engineering requires resolving the scale of the transmitting device while capturing effects many orders of magnitude greater. The RF Module offers you the tools... (read more)
NEi Software, Inc. - Femap
Femap® by Siemens PLM Software is a professional level pre- and postprocessor used for preparing models and viewing the results of engineering analyses for structural, heat transfer, and fluid flow... (read more)
MAYA Heat Transfer Technologies Limited - NX PCB.xchange, NX Thermal and NX Flow
NX PCB.xchange allows for associative and bi-directional data exchange from 2D ECAD systems to 3D MCAD within NX. The 3D board or flexible printed circuit assembly geometry is created automatically... (read more)
MAYA Heat Transfer Technologies Limited - NX™ Flow
NX™ Flow is a computational fluid dynamics (CFD) solution that is fully integrated into the native NX Advanced Simulation environment. It provides sophisticated tools to simulate fluid flow and... (read more)
 

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