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Stress Measurement Calculations of Thin Film Layer Deposition on Wafers Using Dektak Stylus Profilers

From Veeco Instruments
 

 

Film deposition and planarization processes employed in the manufacture of semiconductors,
MEMS, thin film filters and other devices, generate stress in both the substrate and the deposited film. Excessive film stresses can lead to deformation, cracking, delamination, shorts and other failures that can render a device unusable. Accurate assessment of the deformation caused by film stress is critical for developing controllable processes and producing high quality devices.

Veeco's Stress Measurement Analysis, an optional software package for Dektak® stylus profilers, calculates tensile and compressive stresses and displays the results. This application note discusses stress measurement methodology, the algorithms behind the Dektak Stress Measurement Analysis, and important considerations for achieving accurate stress calculations.

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Topics of Interest
Stylus-based surface profi ling is a standard technique for accurate, repeatable surface shape, topography and step height measurement in applications ranging from semiconductor R&D to solar cell QC. (Read More)
Dektak® stylus profilers provide accurate, high resolution measurement of surface shape and texture. The heart of a Dektak system is its measurement stylus, which runs over the surface as the... (Read More)
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