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Using the Dimension X3D AFM in Advanced Photomask Metrology

From Veeco Instruments
 

 

The photomask industry is being challenged as never before; "mask makers' holidays" are a thing of the past. New materials with smaller structures demand innovative ways to address the metrology and processing of photomasks. No single technology will meet all the needs of the customer semiconductor industry.

Reduced process windows due to MEEF (mask error enhancement factor), 1° control of hard shifters, charging of attenuating thin films and photoresist, area control of OPC features, confirmation of complex simulations in printed features, and unprecedented levels of contamination control all add up to a requirement for a flexible, fast metrology solution that won't contaminate the masks during any phase of inspection.


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