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EETimes.com | Electronics Industry News for EEs & Engineering Managers

new pricing paradigm for DRAMs The DRAM industry is expected to enter a new and more positive pricing paradigm, in which the cyclical business is less inclined to follow the path of Moore's Law. CoWare upgrades SystemC-based SoC modeling tools CoWare Inc. has released a significant revision of its SystemC-based ConvergenSC system-on-chip (SoC) design tools that it claims will enable faster modeling and debug of IP models, platform subsystems, and SoC designs in SystemC. Semico conference showcases nonvolatile understudies A trio of vendors pitched their idea of the next big thing in nonvolatile memory technology here on Thursday (Nov. 5). Nvidia Corp.'s third-quarter results were summed up by one analyst in a literary tone &#151 Dr. Jekyll meets Mr. Hyde. Memories may mark early beachhead for nanotech Nanotechnology is moving forward on many fronts with semiconductor memories expected to be one of its first major beachheads in electronics. Oct. 31 to Nov. 6 German firms on hiring spree in Bangalore Siemens AG (Munich) and Robert Bosch (Stuttgart) have announced they will expand their operations in India, joining other German companies such as Infineon Technologies and Daimler Benz that have already set up facilities in the country. DFM is needed at 90-nm As process technologies scale below 0.13-micron, challenges in manufacturing cost-effective new designs are increasing. To address emerging challenges that cannot be resolved through process optimization, comprehensive design-for-manufacturing (DFM) methodologies must be employed throughout the design flow to ensure correct-by-construction, process-aware designs. Acuid tester passes Infineon acceptance test, says CEO Acuid Ltd., the Russo-Scottish company with expertise in high-speed serial data transmission, has received acceptance for its bT144 engineering test platform from Infineon Technologies AG, according to Hans Rohrer, Acuid's chief executive officer. Taiwan's InProComm targets non-PC apps Taiwanese IC designer InProComm Inc. is looking to enter into a variety of
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Product Announcements
SOC America, Inc. - High Voltage Automotive Fuses
The SOC AC500VBL 1030A has been developed to protect the high-voltage circuits in automobiles and other such applications. Despite its compact size of ø10 x 32 mm, this fuse is able to achieve... (read more)
SOC America, Inc. - High Voltage Automotive Fuses
The SOC AC500VBL 1030A has been developed to protect the high-voltage circuits in automobiles and other such applications. Despite its compact size of ø10 x 32 mm, this fuse is able to achieve... (read more)
SOC America, Inc. - Pin Terminal Fuse with a robust Hi-Temp Resistant
SOC introduces the SMC with wire-type fuse-element pin terminal type fuse with a robust high-temperature resistant ceramic structure. Rated Voltage: AC250V with a rated current of 4A. This fuse has... (read more)
SOC America, Inc. - Circuit Protection-Industrial Electronics
Component performance and quality is valued by this sector. Higher operating voltages, greater IRs, extreme operating conditions, and unique technical obstacles may occur. SOC’s quality... (read more)
SOC America, Inc. - Low Profile Surface Mount Fuses
The rated voltage of the DC86V11CT, which employs a wire-type fuse-element, has been increased from DC 72 V to DC 86 V without changing its conventional compact size of 1.6 x 1.05 x 3.2 mm. (read more)
SOC America, Inc. - Low Profile Surface Mount Fuses
The rated voltage of the DC86V11CT, which employs a wire-type fuse-element, has been increased from DC 72 V to DC 86 V without changing its conventional compact size of 1.6 x 1.05 x 3.2 mm. (read more)
SOC America, Inc. - Low Profile Surface Mount Fuses
The rated voltage of the DC86V11CT, which employs a wire-type fuse-element, has been increased from DC 72 V to DC 86 V without changing its conventional compact size of 1.6 x 1.05 x 3.2 mm. (read more)
 
Topics of Interest

CoWare upgrades SystemC-based SoC modeling tools CoWare Inc. has released a significant revision of its SystemC-based ConvergenSC system-on-chip (SoC) design tools that it claims will enable faster...

Book-to-bill up in slow year for fab gear Amid what is considered a "slow year" for fab gear, the worldwide IC-equipment book-to-bill ratio was 0.91 in May, up from 0.82 in April, according...

Artisan in merger talks with NurLogic DRAM makers home in on graphics DRAM makers are bearing down on the graphics market and expect in the first half of next year to launch a GDDR-III memory chip...

APT to repackage power MOSFET die from Infineon Advanced Power Technology announced it would purchase the CoolMOS line of 600 and 800V power MOSFET die from Munich-based Infineon Technologies AG and...

GIVE US YOUR FEEDBACK ON SBN & Silicon Strategies Dear SBN readers: Recently, we took our first steps in greatly expanding our coverage of industry developments in business and technology with the...