From Syfer Technology Limited

In our communications-dominated electronics world, with the focus on 'connected' and wireless portable devices, high frequency design and integration have become critical factors. The integration of digital, analogue and mixed signal circuits continues apace, with RF and microwave circuitry more often included. Notably, however, the integration of associated passive RF and microwave components has progressed far more slowly. These components, principally inductors and capacitors, which form such a small part of a circuit diagram, can now occupy most of the physical space on a printed circuit board implementation. Clearly, increased integration of microwave components, such as filters, baluns and couplers, promises significant advantages.

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Topics of Interest

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2.1 Introduction Scattering parameters (s-parameters) greatly assist in the design, analysis, simulation and measurement of many linear RF and microwave active devices such as transistors and...

Many common circuits make use of inductors and capacitors in different ways to achieve their functionality. Filters, impedance matching circuits, resonators, and chokes are common examples. We study...