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Help with Packet Switching Chips specifications:

Device Type / Function
   Device Type       
   Your choices are...         
   Packet Switching Fabric Chip       Packet switching chips are communication integrated circuits (ICs) used in packet-switched networks to rout packets between network nodes. 
   Crosspoint Switch       A crosspoint switch is a switch matrix with a certain number of inputs and certain number of output switches. Crosspoint switches are used to distribute data and signals in networks and systems. 
   Fabric Manager       Fabric managers control and manage switch fabric systems. 
   Other       Other unlisted or proprietary device types. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Technology / Interface
   Technology       
   Your choices are...         
   Multiprotocol       Multiprotocol interfaces support more than one protocol, such as V.36, V.28, RS232, and V.35, etc. 
   Ethernet       Ethernet is a local area network (LAN) protocol that uses a bus or star typology and supports data transfer rates of 10 Mbps. The Ethernet specification is the basis for the IEEE 802.3 standard, which specifies the physical and lower software layers. To handle simultaneous demands, Ethernet uses carrier sense multiple access / collision detection (CSMA/CD) to monitor network traffic. 
   Fast Ethernet       Fast Ethernet is a networking standard that supports data transfer rates up to 100 Mbps. There are two types of Fast Ethernet: 100Base-X and 100Base-T. 100Base-X uses two physical links, one for transmission and one for reception, between nodes. 100Base-T uses medium access control protocol (MAC). The IEEE 802.3 committee developed the standards for Fast Ethernet. 
   Gigabit Ethernet       Gigabit Ethernet is an Ethernet technology that supports frame transmission at rates above gigabits. 
   Fibre Channel       Fibre channel is a high-speed, serial data transfer architecture that uses links of twisted-pair, coaxial, or fiber optic cable. Small computer system interface (SCSI) devices can use fibre channel arbitrated loop (FC-AL), the most popular fibre channel typology. Using optical fiber, FC-AL supports full-duplex data transfer rates of 100 Mbps. Eventually, FC-AL is expected to replace SCSI in high-performance storage systems. 
   FDDI       Fiber distributed data interface (FDDI) is a reliable, high-speed backbone for mission critical and high traffic networks. It can transport data at a rate of 100 megabits per second, and can support up to 500 stations on a single network. FDDI was designed to run through fiber cables, transmitting light pulses to convey information between stations, but it can also run on copper using electrical signals. 
   Other       Other unlisted or proprietary technology types. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Interface       
   Your choices are...         
   CompactPCI (cPCI) / PXI       Compact PCI (cPCI) is a high-performance industrial bus that uses the electrical standards of the PCI bus and is packaged in a Eurocard. Specifications for the CompactPCI bus are developed and maintained by the PCI Industrial Computers Manufacturers Group (PICMG). cPCI buses are used extensively in systems that require high speed data transfers. Examples include data communication routers and switches, real-time machine control, real-time data acquisition, military systems, etc. 
   Fibre Channel       Fibre channel is a high-speed, serial data transfer architecture that uses links of twisted-pair, coaxial, or fiber optic cable. Small computer system interface (SCSI) devices can use fibre channel arbitrated loop (FC-AL), the most popular fibre channel typology. Using optical fiber, FC-AL supports full-duplex data transfer rates of 100 Mbps. Eventually, FC-AL is expected to replace SCSI in high-performance storage systems. 
   IEEE 1394 (FireWire®)       IEEE 1394 or FireWire® is an interface standard adopted by the Institute of Electrical and Electronics Engineers (IEEE) for very fast digital data transfers such as streaming video. IEEE 1394 connectors are used to transmit and receive data among FireWire devices, and are designed to replace external high-speed peripheral connections to personal computers, including hard disks, CD-ROMs, DVDs, graphics cards, high-speed scanners, direct video, monitors, etc. Tiny, robust FireWire connectors will also become important parts of home entertainment, communication, and appliance networks. FireWire is a registered trademark of Apple Computer, Inc.  
   I2C       Inter-integrated circuit (I2C) bus is a two-wire, low to medium speed, communication bus. 
   PCI       Peripheral component interconnect (PCI) is a local bus system designed for high-end computer systems. PCI buses transfer 32 or 64 bits of data at a clock speed of 33 MHz. They also support 3 to 5 critical peripherals, which are either integrated directly onto the motherboard or added via expansion cards. PCI buses fully support cards that were developed for standard I/O buses. 
   PCI Express       PCI express (PCIe) fits common system architectures, provides greater speed and independence, and increases bandwidth and scalability. PCIe offers 4 Gbps of peak bandwidth per direction and 8 Gbps of concurrent bandwidth. PCIe is referred to as a third-generation input / output (3GIO). 
   PCMCIA / CardBus       PCMCIA devices (PC cards) are credit-card-sized peripherals predominantly used in laptop computers. The PCMCIA adapter takes the place of a COM port on a standard bus. The card is plugged into a 68-pin host socket that is connected either to the motherboard or an expansion bus. An adapter then translates the PCMCIA signals into signals usable by the computer's bus. 
   PCM       Pulse code modulation (PCM). 
   PECL       Positive emitter coupling logic (LVPECL). 
   RS232       RS232 is a standard interface approved by the Electronic Industries Association (EIA) for connecting serial devices. This popular, serial communications standard provides asynchronous communication capabilities with hardware flow control, software flow control, and parity checking. Most gears, instruments with digital control interfaces, and communication devices have an RS232 interface. The typical transmission speed for RS232 is 9600 bps at 15 m. 
   RS422       RS422 supports multipoint connections whereas RS423 supports only point-to-point connections. RS422 provides much longer transmission distances than RS232, but less signal line. RS422 uses a differential transmission technology and provides high-speed transmissions up to 10 Mbps over a maximum transmission distance up to 1.2 km at 110 kbps. 
   RS485       RS485 is almost identical to RS232 except that transmissions are three-way rather than two-way. RS485 is often used in applications where a single controller needs to control multiple devices. Up to 64 devices may be connected with RS485. An enhanced version of RS422, RS485 is compatible with the RS422 interface and provides a two-wire bus topology. Using an RS485 two-wire bus provides a very inexpensive network system; however, RS485 defines only the electronic signal specifications. Consequently, users must define the software protocol for RS485 two-wire communications. 
   SLIC       Subscriber line interface circuits (SLIC). 
   SPI       Serial peripheral interface (SPI). 
   UART       Universal asynchronous receiver transmitter (UART). 
   USB       Universal serial bus (USB) is a 4-wire, 12-Mbps serial bus for low-to-medium speed peripheral device connections to personal computers (PC), including keyboards, mice, modems, printers, joysticks, audio functions, monitor controls, etc. The USB design is standardized by the USB Implementers Forum (USBIF), an organization that includes leading companies from the computer and electronics industries. The current USB specification is USB 2.0, which supports data transfer rates of up to 480 Mbps. 
   USB On-The-Go       USB on-the-go (USB OTG) is an expanded USB 2.0 specification. It is designed to overcome the shortcomings of the original USB 2.0 standard. 
   VME       VersaModule Eurocard bus (VMEbus) is a popular, 32-bit bus used in industrial, commercial and military applications. The VMEbus is based on the VME standard, which defines mechanical specifications such as board dimensions, connector specifications and enclosure characteristics, as well as the electronic specifications for sub-bus structures, signal functions, timing, signal voltage levels, and master/slave configurations.  The VMEbus uses 3U and 6U Eurocard, rugged circuit boards that provide a 96-pin plug instead of an edge connector for durability. Several VMEbus varieties are available.  
   Other       Other unlisted or proprietary interface types. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Performance
   TJ       The full-required range of ambient operating temperatures. 
   Search Logic:      User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.
   Pd       The power dissipated by the device while in the on-state. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Data Rate       The rate or transmission of reception, in bits per second (bps). 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Bias / Operating Current       The minimum current needed for active chip operation. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Supply Voltage:       
   Your choices are...         
   -5 V       Devices operate with -5 V. 
   -4.5 V       Devices operate with -4.5 V. 
   -3.3 V       Devices operate with -3.3 V. 
   -3 V       Devices operate with -3 V. 
   1.2 V       Devices operate with 1.2 V. 
   1.5 V       Devices operate with 1.5 V. 
   1.8 V       Devices operate with 1.8 V. 
   2.5 V       Devices operate with 2.5 V. 
   2.7 V       Devices operate with 2.7 V. 
   3 V       Devices operate with 3 V. 
   3.3 V       Devices operate with 3.3 V. 
   3.6V       Devices operate with 3.6 V. 
   5 V       Devices operate with 5 V. 
   Other       Other unlisted supply voltages. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Packaging
   IC Package Type:       
   Your choices are...         
   Bare Die        Devices are sold in semiconductor die form. They do not have a case or packaging. 
   BGA       Ball-grid array (BGA) places output pins in a solder ball matrix. Generally, BGA traces are fabricated on laminated (BT-based) substrates or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has another advantage of lower ground or power inductance by assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanisms (heat sink, thermal balls, etc.) can be applied to BGA to reduce the thermal resistance. The sophisticated capabilities make BGA the desirable package to implement electrical and thermal enhancement in response to the need for high power and high speed ICs. 
   FCBGA       Flip chip ball-grid array (FCBGA) uses a combination of flip chip and ball grid array features. FCBGA enables short electrical paths for high frequency applications. The simultaneous soldering of all joints in one pass through a reflow furnace facilitates the mounting of packages with thousands of solder joints. 
   PBGA       Plastic ball-grid array (PBGA) is the general terminology for the BGA package adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA refers to an overall thickness of over 1.7mm. 
   MCM-PBGA       Multi-chip module plastic ball-grid array (MCM-PBGA). 
   SBGA       Super ball-grid array (SBGA) provides a high-power BGA package with a very low profile. With SBGA, the IC is directly attached to an integrated copper heatsink. Since the IC and I/O are on the same side, signal vias are eliminated, providing a significant improvement in electrical performance (inductance). 
   TBGA       Tape ball-grid array (TBGA). 
   CPGA       Ceramic pin-grid array (CPGA). 
   PPGA       Plastic pin-grid array (PPGA). 
   FCPGA       Flip-chip pin-grid array (FCPGA) attaches the chip to the board facedown, without any wire bonding. 
   IPGA       Interstitial package grid array (IPGA) carries additional pins on a 0.5" offset pattern in between the pins of a regular PGA pattern. It almost doubles the available pins on the same package size as a standard PGA. 
   PGA       Pin grid array (PGA) is a second generation package that uses through-hole technology (THT). Pins are located on a 0.1" grid in various patterns. Package size is reduced by moving pins to the underside of the package in a grid pattern. 
   CSP       Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.   
   FCCSP       Flip-chip chip-scale package (FCCSP). 
   SuperFC®       Super flip-chip or SuperFC® packages feature a controlled bond line die attached directly to a copper heat spreader.  SuperFC® is a registered trademark of Amkor. 
   UCSP       Ultra chip scale package (UCSP). 
   WLCSP       Wafer-level chip-scale package (WLCSP) allows an IC to be attached facedown so that its pads connect to the printed circuit board (PCB) through individual solder balls without any underfill material. WLCSP minimizes IC-to-PCB inductance, features small package size, and provides enhanced thermal conduction. 
   LGA       Tape ball-grid array (TBGA) uses a fine, polyimide substrate and provides good thermal performance with high pin counts. 
   FLGA       Fine-pitch land-grid array (FLGA) is extremely compact and lightweight, making it suitable for miniature disc drives and digital cameras. 
   QFP       Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications.   
   LQFP       Low quad flat package (LQFP). 
   TQFP       Thin quad flat package (TQFP). 
   PQFP       Plastic quad flat package (PQFP). 
   QFN       Quad flat non-leaded package (QFN) is also known as QFNL. 
   VQFP       Very thin quad flat package (VQFP). 
   MSOP       Mini small outline plastic package (MSOP) products are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. The carrier tape is made from dissipative polystyrene resin. The cover tape is a multilayer film composed of a polyester film, adhesive layer, heat-activated sealant, and anti-static sprayed agent. The reel is made of polystyrene plastic (anti-static coated or intrinsic) and individually bar coded. Reels are placed inside barcode-labeled boxes for shipping. 
   PSOP       Power small outline package (PSOP). 
   SOP       Small outline package (SOP). 
   QSOP       Quarter size outline package (QSOP). 
   MLP       Micro lead-frame package (MLP) is an ultra-slim, miniature package with a typical height of only 0.75 mm, length of 2 mm, and width of 3 mm. 
   SOIC       Small outline integrated circuit (SOIC). 
   TSOJ       Thin small outline J-leaded package (TSOJ). 
   TSOP Type I, Type II       Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II. 
   TSOP Type I       Thin small outline package (TSOP), Type I is a DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. 
   TSOP Type II       Thin small outline package (TSOP), Type I is a DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. 
   SSOP       Shrink small outline package (SSOP). 
   VSSOP       Very thin shrink small outline package (VSSOP). 
   TVSOP       Thin very small outline package (TVSOP). 
   TSSOP       Thin shrink small outline L-leaded package (TSSOP). 
   SOJ       Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device. 
   HSOF       Small outline flat-leaded package with heat sink (HSOF). 
   HSOP       Small outline with heat sink package (HSOP). 
   PLCC       Plastic leaded chip carrier (PLCC). 
   LCCC       Leadless ceramic chip carrier (LCCC). 
   DIP       Dual in-line package (DIP) is a type of semiconductor component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. The pins are distributed into two parallel lines along opposite site of the rectangular package. There are several types of DIP packages, such as Ceramic Dual in-line package (CDIP), Plastic Dual in-line package (PDIP), and Shrink Plastic Dual in-line package (SPDIP). 
   CDIP       Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade. 
   PDIP       Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications. 
   SIP       Single in-line package (SIP) is a semiconductor package which has only one row of pins. 
   SDIP       Shrink dual in-line package (SDIP). 
   SC-70       SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops and other portable and hand-held applications where space is extremely limited. 
   SZIP       Shrink zigzag in-line package (SZIP). 
   TDFN       Thin dual flat no-lead (TDFN) packages are fine-pitch, high-performance replacements for 6-pin SOT23 and SC-70 packages. TDFM offers improved thermal characteristics and reduced parasitic compared to these other packages. With the same footprint as equivalent MLF and Mini-BGA packages, TDFM has a much smaller footprint than SOT23 packages. 
   SOT23       SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment. 
   Other       Other unlisted, specialized, or proprietary IC packages. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Pin Count       The number of pins in the package. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Number of Devices in Package       The total number of devices in the IC package. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Features
           
   Your choices are...         
   RoHS Compliant       Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl and polybrominated diphenyl ether. 
   Supports CODEC       The device has embedded circuitry to support CODEC. 
   ESD Protected       The interface has embedded electrostatic discharge (ESD) protection. 
   JTAG pin       Joint Test Action Group (JTAG) products are semiconductor devices that allow access to the inner workings of an IC for testing, controlling, and programming purposes. 
   Over-Voltage Protection       The interface has an embedded, over-voltage protection system 
   Integrated Charge Pump       Charge pumps are circuits that generate higher voltages from low-voltage inputs by using capacitors as storage elements. They are used in notebook computers and mobile phones. 
   Built-In Oscillator       The device has an internal oscillator. 
   Automatic Power Control Loop (APC)       The device has an embedded power control loop (APC) to maintain average output power over temperature range and lifetime. 
   Thermal Shutdown       The interface has an embedded, over-thermal protection system which shuts down the chip when a maximum temperature is reached. 
   Integrated Clock       The device has an integrated real-time clock circuit. 
   Embedded PLL Synthesizer       The device has an embedded phase-lock loop (PLL) synthesizer. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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