Help with Elastomers and Rubber Materials specifications:
Resins & Compounds
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| Compound Type: | |||
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| Casting Resin | Casting resins are plastic or elastomer compounds used to cast parts, molds, or to form a structure in place. Casting resins usually consist of a two-part (A+B) system that is placed into open molds or forms, where A is the resin and B is the catalyst or hardener. The fabricator mixes the components to initiate the curing process. | ||
| Film Grade Resin | The plastic, elastomer, or plastic material is graded for use in the production of film or thin sheet. | ||
| Extrusion Grade Resin | Plastic or elastomer grades are suited for fabricating parts by extrusion or pultrusion. | ||
| Molding Resin | Molding resins are plastics or elastomers that are suited for the fabrication of parts via injection molding, compression molding, blow molding or film extrusion, reaction injection molding (RIM), resin transfer molding (RTM) or molded stock shapes. | ||
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| Material Form | |||
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| Gel | Polymers, elastomers or resins offered the form of a high-to-moderate viscosity "solid" gel or liquid gel. Elastomer gel materials are used in cushioning, and bumper or shock absorption applications. | ||
| Liquid | Adhesive, sealant, or resins are in the form of a low-to-moderate viscosity liquid. | ||
| Pellets | Resins are in the form of pellets, powder, granules, or other feed stock forms such as bulk or sheet molding compounds. | ||
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Material System
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| Material Type / Grade | |||
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| Composite Material | Composite material is filled with a strengthening phase, reinforcement fibers, toughening phase, or other specialty fillers that provide unique properties. | ||
| Thermoplastic / TPE | Thermoplastics can be repeatedly softened by heat and then hardened, or set by cooling, which allows parts to be injection molded or thermoformed and scrap to be reprocessed. | ||
| Thermoset (Crosslinked / Vulcanized) | Thermoset plastics and thermoset resins are cross-linked polymeric resins that are cured using heat or heat and pressure. Cured thermoset resins generally have higher resistance to heat than to thermoplastics, but melting cannot reprocess them. | ||
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| Chemical / Polymer System Type | |||
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| Acrylic | Acrylic polymers are formed by polymerizing acrylic acids through a reaction with a suitable catalyst. Acrylics are known for excellent environmental resistance and fast-setting times compared to other resin systems. | ||
| Butyl / Polyisobutylene | Elastomeric materials are based upon or use a butyl, polybutene, or polyisobutylene chemical system. Chlorinated isobutylene or chlorobutyl can be used alone or in blends with other polymers to achieve special properties. Butyl is a common term used for the isobutylene isoprene elastomer. It provides resistance to water, steam, alkalis, and oxygenated solvents. Butyl has low gas permeation and is capable of providing high-energy absorption (dampening) and good hot tear strength. The suggested operating temperature for butyl is -75° to 250° F. | ||
| Ethylene Copolymer | Ethylene copolymers include (poly)ethylene acrylate acid (EAA), (poly)ethylene methyl acrylate (EMAC), (poly)ethylene ethyl acrylate (EEA), (poly)ethylene vinyl acetate (EVA), (poly)ethylene butyl acrylate (EBAC), (poly)ethylene vinyl acetate (EVA or EVAC), (poly)ethylene vinyl alcohol (EVAL or EVOH), and (poly)ethylene propylene terpolymer (EPM). | ||
| Fluoroelastomer | Polymers are based on fluoropolymer chemical systems, such as polytetrafluoroethylene (PTFE) or polyvinylidene fluoride (PVDF). Fluoropolymers are used in applications requiring superior chemical resistance. PTFE is used in applications requiring superior chemical resistance or low friction. | ||
| Isoprene / Polyisoprene | Natural rubber is based on polyisoprene or isoprene chemical systems. Synthetic or man-made versions of isoprene are also available. | ||
| Polybutadiene | Polybutadiene is a commonly used polymer system with dielectric potting compounds and coatings. It can be combined with other rubber polymers to form flexible sealants. Polybutadiene remains flexible even at low temperatures. | ||
| Polyethylene (PE) | Polymers or resins are based on the polyethylene chemical system. Low density polyethylene polymers are used to form a variety of common or commodity-plastic components. High density (HDPE) and ultra-high molecular weight polyethylene (UHMW PE) have good friction and mechanical properties. They are used in medical devices, wear parts, and engineered components. | ||
| PET / PBT | The polyethylene terephthalate (PET) and polybutylene terephthalate (PBT) polymer systems are based on a thermoplastic polyester or terephthalate system. | ||
| Polypropylene (PP) | Polypropylene (PP) is commonly used in hot-melt adhesive systems. PP is a polymer based on polypropylene chemical bonds. | ||
| Polysulphide | Polymer resins or compounds are based on polysulfide or polyphenylene sulfide (PPS) chemical systems. | ||
| Polyurethane | Polyurethane (PUR) resins provide excellent flexibility, impact resistance, and durability. Polyurethanes are formed through the reaction of an isocyanate component with polyols or other active hydroxyl group compounds. Polyurethanes require a catalyst, heat, or air evaporation to initiate and complete curing. | ||
| Silicone | Plastic compounds, elastomer resins, or polymers are based on the silicone chemical system. Silicones are produced through the hydrolysis and polymerization of silanes and siloxanes. | ||
| Styrene Copolymer (SBR, etc.) | Products are based upon a styrene copolymer system such as styrene acrylonitrile (SAN), acrylic styrene acrylonitrile (ASA), acrylonitrile ethylene styrene (AES), styrene maleic anhydride (SMA), styrene-isoprene-styrene (SIS), styrene-butadiene-styrene (SBS), or styrene butadiene rubber (SBR). Styrene butadiene rubber (SBR) has good resistance to petroleum hydrocarbons and fuels. SBR is used widely with oils, hydraulic fluids, and alcohol. Many compound variations are available for specific applications. The suggested operating temperature for SBR is -30° to 275° F. Styrene-isoprene-styrene (SIS) and styrene-butadiene-styrene (SBS) copolymers are commonly applied in pressure-sensitive adhesive applications. | ||
| Vinyl | Polymers are based on the vinyl chemical system. Examples include polyvinyl chloride (PVC), polyvinylidene chloride (PVDF), polyvinyl vinyl acetate (PVA), and polyvinyl alcohol (PVOH). | ||
| Specialty / Other | Other specialty, proprietary or unlisted resin, chemical system or compound, or polymer type. | ||
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| Filler Material: | |||
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| Unfilled | Raw materials or unfilled resins do not contain any additional modifiers such as fillers, colorants, dispersants, plasticizers, wetting agents, levelers, or defoamers. These products are used as starting components or raw materials for the production of finished plastic resins, elastomers, adhesives, sealant, coatings, or other polymer-based products. | ||
| Aramid Fiber | Polyimide (polyphthalamide) is a fiber-based reinforcement, such as DuPont’s Kevlar® fiber material. Aromatic polyimides are among the most thermally-stable organic materials known. | ||
| Carbon / Graphite | Compounded polymers or elastomers use carbon or graphite powder, or fiber filler. Depending on the structure, carbon can strengthen or provide some improvement in electrical and thermal conductivity. | ||
| Fiber Glass | Compounded polymer or elastomer products are filled with glass powder, fibers, or cloth to provide improved strength and/or stiffness. | ||
| Metal | Compounds use metal powder or metal fiber fillers. | ||
| Mineral | Compounded polymers or elastomers are filled with a mineral, ceramic, silicate, or other inorganic powder or fiber. | ||
| Other | Other unlisted, specialized, or proprietary filler types. | ||
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Features & Industry
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| Features | |||
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| 100% Natural / Recycled | Products are made solely of natural, green, and/or recycled raw materials. | ||
| Anti-static | Anti-static materials are designed with relatively high electrical conductivity or low electrical resistivity. They are used in electronic, anti-static, and electrostatic discharge (ESD) applications. | ||
| Bullet Proof / Cut Proof | The resin / material has the strength and energy-absorptive properties that make it suitable for use as armor, bulletproof protection, or personnel shielding. | ||
| Biocompatible | The resin / material is a biopolymer or a biocompatible polymer suitable for medical and biological use in contact with living tissue. | ||
| Electrically Conductive Compound | Resins or compounds have a high degree of electrical conductivity (low resistivity) for applications such as anti-static or ESD control, EMI / RFI shielding, thick film metallization, and device and board electrical interconnection. | ||
| EMI / RFI Shielding | Polymers or elastomers are designed to provide shielding from electromagnetic interference (EMI) or radio frequency interference (RFI). These compounds typically have a high degree of electrical conductivity. | ||
| Flame Retardant (e.g. UL 94 Rated) | The material is flame-retardant in accordance with industry standards, such as Underwriters Laboratories, Inc. (UL), Flame Class 94, or other ISO standards. These materials reduce the spread of flame or resist ignition when exposed to high temperatures. They also insulate the substrate and delay damage to the substrate. | ||
| Optical Grade | Polymers or elastomers are designed for optical or photonics applications, such as transparent polycarbonate or acrylic lens materials. | ||
| Thermally Conductive | Materials are designed to form a thermally conductive layer on the substrate, between components or within a finished electronic product. Thermally conductive resins, thermoplastics, encapsulants, potting compounds, tapes, pads, adhesives, and greases are often used between a heat-generating electrical device and a heat sink to improve heat dissipation. | ||
| Thermally Insulating | Thermally insulating resins, plastics, compounds and encapsulants provide a thermal barrier between components and a hot or cold source. | ||
| UL Approved | The material is approved to or recognized under one or more requirements of Underwriters Laboratories, Inc. (UL). | ||
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| Industry: | |||
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| Aerospace | Products are designed for aerospace applications. For example, they can be used to bond composite structures to other composite or metallic frame components. | ||
| Automotive | Products are designed for automotive applications. For example, they can be used to bond panels and seal windows. | ||
| Electronics | Products are designed for electronics applications. For example, they can be used in potting or encapsulating compounds, conductive adhesives, and dielectric sealants. | ||
| Energy Conversion (Battery/Fuel Cell/PV) | The resin / material is suitable for use in batteries and fuel cells, as well as in photovoltaic (PV) and related devices. | ||
| Electric Power | Products are resins, compounds, and plastic composites suitable for electrical power or high voltage applications such as generator or motor assemblies, coil or transformer manufacturing, and switch or circuit breaker insulation. | ||
| Optoelectronics | Products are designed for optoelectronics or photonics applications, such as cements for bonding simple lenses into compound structures. | ||
| Semiconductor / IC's | Products are designed or suitable for semiconductor or semiconductor packaging applications. | ||
| Marine | Products are designed for marine applications. They can be immersed in water and withstand exposure to marine atmospheres. | ||
| Medical / Food (FDA) | Products are suitable for medical or food-contact applications. They typically comply with requirements from regulatory agencies such as the Food and Drug Administration (FDA), U.S. Department of Agriculture (USDA), National Science Foundation (NSF), 3A-Dairy, Canada AG, or USP Class VI. | ||
| Military / Government (MIL-SPEC) | Products meet U.S. military specifications (MIL-SPEC). | ||
| Industrial | Products are designed for use by original equipment manufacturers (OEMs) for the assembly, sealing, or fabrication of products. | ||
| Building / Construction | Products are designed for use by construction contractors and in maintenance, repair, and operation (MRO) applications. Adhesives or sealants can be designed for general-purpose construction or architectural applications. Construction materials include wood, wood products, glass, cement products (mortar, concrete, masonry), plaster board, metal trim, flooring tile, sub-floor or underlayment, plaster board, sheet metal roofing or flash, metal ties, insulation materials (fiberglass, foam), and bitumen-based roofing materials. | ||
| Tooling / Molds | Products are designed for tooling or mold fabrication such as polyurethane shapes or castable silicones. | ||
| Other | Other unlisted industry. | ||
| Search Logic: | All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches. | ||
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Thermal Properties
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| Use Temperature | Use temperature is the range of temperatures to which products can be exposed without the degradation of structural or other required end-use properties. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Deflection Temperature (@ 264 psi, 1.8 MPa) | Deflection temperature is the temperature range to which the material can be exposed without the degradation of structural or other required end-use properties at 264 psi or 1.8 MPa. . | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Thermal Conductivity | Thermal conductivity is the linear heat transfer per unit area through a material for a given applied temperature gradient. Heat flux (h) = [thermal conductivity (k) ] x [temperature gradient (Δ T)] | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Coeff. of Thermal Expansion (CTE) | Coefficient of linear expansion (CFE) is the amount of linear expansion or shrinkage that occurs in a material with a change in temperature. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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Mechanical Properties
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| Tensile Strength (Break) | Tensile strength at break is the maximum amount of stress required to fail or break the material under tension loading test conditions. Tensile tests are typically performed according to test procedure standards such as ASTM D-638 or ISO 527-1, ASTM D-1708, ASTM D-2289 (plastics at high strain rates), and ASTM D-882 (thin plastic sheets), as well as other OEM proprietary standards. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Tensile Modulus | Young's modulus or the modulus of elasticity is a material constant that indicates the variation in strain produced under an applied tensile load. Materials with a higher modulus of elasticity have higher stiffness or rigidity. | ||
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| Elongation | Elongation is the percent amount of deformation occurring during a tensile test or other mechanical test. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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Electrical & Optical Properties
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| Electrical Resistivity | Resistivity is the longitudinal electrical resistance (ohm-cm) of a uniform rod of unit length and unit cross-sectional area. Resistivity is the inverse of conductivity. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Dielectric Strength | Dielectric strength is the maximum voltage field that the material can withstand before electrical breakdown occurs. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Dielectric Constant | The dielectric constant is the relative permittivity of a material compared to a vacuum or free space. k = εr = ε / εo= where ε is the absolute permittivity of the material and εo is the absolute permittivity of a vacuum 8.85 x 10-12 F/m. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Index of Refraction | The index of refraction is a measure of the speed of light in a material. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Light Transmission | This is the amount of light transmitted through a material. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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Processing & Physical Properties
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| Viscosity | Viscosity is a measurement of a fluid's resistance to flow. Water is lower in viscosity than motor oil or honey. Oil is lower in viscosity than tar or molasses. Depending on the application method, viscosity determines how well a resin fills the cavities or voids in a mold. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Melt Flow Index (MFI) | Melt flow index (MFI) is the output flow rate in grams that occurs in 10 minutes period through a standard die of 2.0955 mm diameter and 8.000 mm in length, while a fixed pressure is applied to a 190°C melt via a piston. Blow molding and extrusion processes tend to use resins with lower MFI values. Injection molding typically utilizes higher MFI polymers. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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| Water Absorption | The amount of water absorbed by the material. | ||
| Search Logic: | User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria. | ||
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