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Indium Corporation


News articles and press releases for Indium Corporation:

01/17/2017

Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will lead three sessions at the IPC APEX Expo technical conference on February 11-16 in San Diego, Calif.

01/10/2017

Indium's Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Tim Jensen, Senior Product Manager for Engineered Solders Materials, will present at Pan Pacific Microelectronics Symposium 2017 in Kauai, Hawaii, Feb. 6-9, 2017.

01/03/2017

Indium Corporation’s Dr. Ning-Cheng Lee, VP of Technology, has been bestowed the prestigious title of Fellow of the Institute of Electrical & Electronics Engineers (IEEE) for his leadership in surface mount technology and interconnect materials.

12/15/2016

Gold is often used in electronics assembly because it resists oxidation and solders readily. This makes gold ideal for plating contact surfaces for switches and connectors.

12/13/2016

Indium Corporation's Dr. Ron Lasky, Senior Technologist, discusses the importance of indium tin oxide (ITO) in touchscreen and flat panel technology in a video available at www.indium.com/blog/phil-zarrow.

12/08/2016

Indium Corporation will feature halogen-free Indium8.9HF no-clean solder paste at NEPCON Japan 2017 Jan. 18-20 in Tokyo, Japan. Indium8.9HF specifically formulated to Avoid the Void™, while delivering high transfer efficiency with low variability.

12/06/2016

Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste to help customers Avoid the Void™ at IPC APEX Expo on Feb. 11-16 in San Diego, Calif

11/30/2016

Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, was recognized for his technical presentation at the IMAPS Autumn Conference in October in Munich, Germany.

11/10/2016

Indium Corporation's Bill Jackson, Director and General Manager of Compounds, and SMT expert Phil Zarrow, President and Principal Consultant for ITM Consulting, discuss the applications of indium.

11/03/2016

Indium Corporation announces that Jingya Huang has joined the company as Marketing Communications Assistant Manager.

10/17/2016

Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, will deliver a technical presentation at the IMAPS Autumn Conference on Oct. 20-21 in Munich, Germany.

10/14/2016

Indium Corporation’s Ivan Castellanos, Technical Services Manager, Latin America, recently hosted the highest-attended SMT Processes Certification course ever, with 34 attendees.

10/13/2016

Indium Corporation was presented with the Global Technology Award for Solder Paste for Indium10.1HF Solder Paste at SMTA International (SMTAI) Conference in Rosemont, Ill.

10/06/2016

Indium Corporation’s Jason Chou, Area Technical Manager for Taiwan, and Kenny Chiong, Senior Technical Support Engineer, will present at 2016 Electronics Packaging Technology Conference (EPTC) on Nov. 30-Dec. 3 in Suntec City, Singapore.

10/05/2016

Indium Corporation's newest informational video provides an overview of the versatility of indium when alloyed with other metals.

09/30/2016

Jonas Sjoberg, Technical Manager, will present DfX for High-Density Assemblies, which covers the basic principles and understanding of manufacturability (DfM) and reliability (DfR).

09/28/2016

Several Indium Corporation experts will share their knowledge and expertise at IMAPS 49th International Symposium on Microelectronics (IMAPS 2016 - Packaging the Connected World), Oct. 10-13, in Pasadena, Calif.

09/13/2016

Several Indium Corporation experts will share their knowledge and expertise at the SMTA International Conference Sept. 25-29 in Rosemont, Ill.

09/08/2016

Indium Corporation, the industry leader for void-reducing solutions, will chair a special session focusing on void reduction in bottom-terminated components (BTCs) at the SMTA International Conference on Sept. 29 in Rosemont, Ill.

09/01/2016

Indium Corporation’s Sze Pei Lim, Semiconductor Product Manager – Asia, will present at the 13th International Wafer-Level Packaging Conference (IWLPC 2016 – Bridging the Interconnect Gap), Oct. 18-20, in San Jose, Calif.

08/30/2016

Indium Corporation experts will deliver several technical presentations at the 37th International Electronics Manufacturing Technology and 18th Electronics Material & Packaging Conference (IEMT-EMAP 2016), Sept. 20-22, in Penang, Malaysia

08/18/2016

Indium Corporation will feature its reinforced indium and solder alloy fabrications, InFORMS®, at IMAPS 49th International Symposium on Microelectronics (IMAPS 2016 - Packaging the Connected World), Oct. 10-13, in Pasadena, Calif.

08/09/2016

The Annual Perfect Quality Award was presented to Ross Berntson, Indium Corporation Executive Vice President, at ON Semiconductor’s Supplier Executive Conference on June 8, in Phoenix, Ariz.

08/02/2016

Indium Corporation's new reclaim and recycle program is now offering customers credit for their solder pot dross and contaminated solder.

07/14/2016

Indium Corporation's indium tin oxide (ITO) and indium gallium zinc oxide (IGZO) reclaim and recycle program enables customers to earn a greater return on production materials.

07/13/2016

Indium Corporation, the industry-leading source of void-reducing materials and results, has specifically formulated Indium10.1 Solder Paste to reduce voiding significantly below the industry average – for improved finished goods reliability

06/16/2016

Indium is used extensively in thermal management, low-temperature soldering, and sealing applications. In many instances, the indium is not fully consumed and can be reclaimed from the process.

06/02/2016

Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, named to the International Microelectronics Assembly and Packaging Society (IMAPS) Global Business Council Steering Committee.

05/24/2016

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will chair the professional development course, Materials Considerations for Achieving High Reliability Lead-Free Soldering, at (ECTC),

05/03/2016

Indium Corporation’s Eric Bastow, Assistant Technical Manager, has become one of only a handful of technologists to earn a re-certification of the Surface Mount Technology Association’s (SMTA) SMT Processes designation.

04/27/2016

Indium Corporation's germanium reclaim and recycle program enables customers to increase their return on materials by providing credit for diverting spent germanium from the waste stream.

04/26/2016

Dr. Lee’s webtorial, Low-Temperature Solders: New Developments and Applications, will cover varieties of low-temperature solders with emphasis on lead-free alloys, their physical, mechanical, and soldering properties, and their applications.

04/22/2016

Karch provides support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials, including solder paste, solder preforms, fluxes, and thermal management materials.

04/14/2016

Indium Corporation’s Kenneth Thum, Senior Technical Support Engineer, will present Risk of No-Clean Flux Not Fully Dried Under Component Terminations at IPC Thailand on April 26 in Bangkok, Thailand.

04/12/2016

Indium Corporation announces the release of Indium10.2HF, a halogen- and Pb-free, no-clean solder paste that is specifically formulated to address in-circuit testing challenges.

03/29/2016

Hults works closely with other members of the Indium Corporation team to coordinate global resources that enhance relationships. He also develops and executes strategies that nurture existing accounts and encourage the growth of new business.

03/22/2016

Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.

03/17/2016

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present a two-part workshop at SMT Hybrid Packaging 2016, on April 26-28 in Nuremberg, Germany.

03/15/2016

Manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs. Indium Corp. will help customers Avoid the Void™ with its void-reducing no-clean solder pastes at IPC APEX Expo on March 15-17 in Las Vegas.

03/15/2016

Indium Corporation has been named winner of the annual CIRCUITS ASSEMBLY Service Excellence Award for Materials at IPC APEX Expo on March 15 in Las Vegas, Nev

03/10/2016

Indium Corporation will be running its low-voiding solder products “Live@APEX” in partner booths throughout IPC APEX Expo onMarch 15-17 in Las Vegas, Nev.

03/03/2016

Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at SEMICON China on March 14, 2016, in Shanghai, China.

03/02/2016

Indium Corporation announces the promotions of Sze Pei Lim to Regional Product Manager for Semiconductor Products in Asia and Jonas Sjoberg to Technical Manager for Asia.

03/01/2016

Indium Corporation’s Wolfgang Bloching, Regional Sales Manager – Germany, Austria, and Switzerland, will present at the EPP Innovations Forum on March 10 in Böblingen, Germany.

02/24/2016

Indium Corporation announces the release of PoP Flux 89LV-P, a bright pink-colored, no-clean, thixotropic flux helps engineers Avoid the Void™ by greatly improving visual inspection to minimize voiding and other defects in package-on-package applications.

02/18/2016

Indium Corporation will feature “Power-Safe” NC-SMQ®75, world’s first and only die-attach solder paste suitable for non-cleaned clip bond applications power semiconductor die-attach applications, SEMICON China March 15-17, 2016, in Shanghai, China.

02/17/2016

Indium Corporation will feature Indium3.2HF water-soluble solder paste at Productronica China on March 15-17, 2016, at the Shanghai New International Expo Centre in Shanghai, China.

02/16/2016

Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will present at the IPC APEX Expo technical conference on March 13-17 in Las Vegas, Nev.

02/11/2016

Indium Corporation's Indium8.9HF is a halogen-free, no-clean solder paste that is specifically formulated to Avoid the Void™, while delivering high transfer efficiency with low variability.

02/09/2016

Indium Corporation will feature Heat-Spring®, a compressible, recyclable, metal thermal interface material, at Strategies in Light on March 1-3 in Santa Clara, Calif.

02/04/2016

Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo, which will be held on March 15-17 in Las Vegas, Nev.

01/05/2016

Indium Corporation will feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016, Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical.

12/08/2015

Indium Corporation will feature its reinforced indium and solder alloy fabrications InFORMS® at NEPCON Japan, Jan. 13-15 in Tokyo, Japan.

12/01/2015

Indium Corporation was presented with the Global Technology Award for Best Products – Americas for InFORMS® high-reliability solder preforms, on Nov. 10 at Productronica in Munich, Germany.

11/16/2015

Traditional gallium trichloride is solid at room temperature and often forms clumps or sticks together during storage and use. This inhibits the efficient and consistent materials transfer between vessels and processing equipment.

11/06/2015

Vareha-Walsh brings extensive metals market experience from her previous roles, including Director of Global Procurement, Director of Metallurgical Procurement, Plant Controller, and Global Business Manager.

10/30/2015

Indium Corporation announces the release of its newest informational video that describes how solder preforms can reduce voiding in bottom termination components.

10/28/2015

Indium Corporation announces the release of its newest informational video that provides real-world examples of how solder materials performance affects electronics manufacturing productivity and profitability

10/27/2015

Indium Corporation will feature void-reducing Indium8.9HF, a halogen-free, no-clean solder paste, at Productronica 2015, Nov. 10-13, in Munich, Germany.

10/22/2015

Indium Corporation announces the release of its newest informational video detailing the benefits of using low-temperature solder alloy systems based on indium and bismuth.

10/20/2015

Indium Corporation announces the release of its newest informational video that guides the audience on the proper steps for selecting a solder preform.

10/19/2015

Indium Corporation announces the release of its newest informational video that discusses InFORMS®, a revolutionary product designed to achieve uniform bondline thickness for a stronger final solder joint.

10/16/2015

Indium Corporation announces the release of its newest informational video that provides real-world examples of drastic improvements of electronics manufacturing uptime and productivity.

10/15/2015

Indium Corporation's Tim Jensen, Senior Product Manager for Engineered Solders, will lead a professional development course at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26, in Orlando, Fla

10/14/2015

Indium Corporation announces a soft metal alloy thermal interface material (SMA TIM) that offers high and uniform thermal resistance at lower applied stresses in compressed interfaces.

10/09/2015

Indium Corporation announces the release of its newest technology publication, SMT with Phil Zarrow, authored by SMT expert Phil Zarrow, President and Principal Consultant for ITM Consulting.

10/01/2015

Several Indium Corporation experts will share their knowledge and expertise at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26-29, in Orlando, Fla.

09/29/2015

Indium Corporation’s Indium6.4R is a versatile, water-soluble solder paste flux that enables a low cost of ownership for PCB assembly customers through an all-around, balanced performance.

09/22/2015

Indium Corporation's Sze Pei Lim, Technical Manager for Southeast Asia, will present at the Microelectronics Tech Asia Singapore Conference on Sept. 28-29 in Singapore.

09/10/2015

Indium Corporation's Claire Mikolajczak, Director, Metals & Chemicals, will share her expertise at the EU Critical Raw Materials: Essential for Your Business and Your Industry Now and in the Future, Sept. 16 in Stuttgart, Germany.

08/11/2015

Indium Corporation announces that several company technologists have earned their designation as SMTA-Certified Process Engineers, further expanding the largest SMTA-certified engineering team in the industry.

07/21/2015

Indium Corporation is celebrating 20 years of service and supply from its Asia-Pacific operations to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Based in Singapore, the facility serves customers worldwide.

07/16/2015

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present at ICEPT 2015, August 11-14 in Changsha, China.

07/14/2015

Indium Corporation’s Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at European Power Electronics and Drives’s (EPE) 17th Conference on Power Electronics and Applications, Sept. 8-10 in Geneva, Switzerland.

01/30/2014

Indium Corporation announces a new solder paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications.

11/13/2013

Indium Corporation was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12.

11/05/2013

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, and Dr. Ron Lasky, Senior Technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in Milpitas, California.

11/01/2013

ndium Corporation’s Brook Sandy-Smith, Product Specialist for PCB Assembly Materials, was presented with a Distinguished Committee Service Award by the IPC at SMTA International in Fort Worth, Texas on October 15.

10/29/2013

Indium Corporation will feature its new technology platform using the SACM™ Solder Alloy at Productronica November 12-15 in Münich, Germany.

10/24/2013

Indium Corporation continues to expand its existing line of solder products to provide customers with a consistent and reliable supply of soldering materials, thereby allowing customers to consolidate sources, reduce cost, and increase reliability.

10/22/2013

Indium Corporation was awarded the first IPC J-STD-004 Qualified Products Listing (QPL) certificate by the IPC Association at the fall IPC Standards Development Committee Meetings.

10/17/2013

Indium Corporation hosted 45 students and teachers from Herkimer BOCES on October 8 as part of their celebration of National Manufacturing Day.

10/10/2013

LV1000 reduces false failures while increasing productivity, throughput yields, and component performance.

10/03/2013

Indium Corporation is celebrating National Manufacturing Day, Oct 4, with a variety of activities intended to promote STEM (science, technology, engineering, & math) education & career opportunities in advanced manufacturing in the Mohawk Valley.

10/01/2013

Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, will present at the 2013 Electronics Packaging Symposium October 15-16 at Binghamton University in Binghamton, New York.

09/26/2013

Several Indium Corporation technology experts will present at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) on October 15-17 in Fort Worth, Texas

09/24/2013

Gold-based solders provide superior thermal fatigue resistance, resistance to corrosion, & the highest tensile strength of any solder. Indium Corpwill feature high-reliability gold-based solders at IMAPS Sept 30 – Oct 3 in Orlando, Florida

01/30/2013

Indium Corporation technology experts will share their technical expertise at the IPC APEX Expo February 19-21 in San Diego, California.

12/13/2012

The School and Business Alliance, a service of Oneida-Herkimer-Madison BOCES, assists students in making successful transitions from school to careers, and supports the development of a qualified workforce in the Mohawk Valley.

09/13/2012

Indium Corporation’s Technical Manager for European Operations Karthik Vijay will present at two upcoming technical conferences in the United Kingdom and the Netherlands.

08/16/2012

Indium's gold-based solder alloys provide reliable joint strength & superior thermal conductivity, especially as compared to standard SnPb or SAC solders. IMAPS is 9/9-9/13 in San Diego

08/14/2012

Indium Senior Technical Support Engineer Mario Scalzo will present "The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes" at IPC Midwest Conference & Exhibition 8/23/12

08/03/2012

Indium Corporation introduces the Indium8.9 Solder Paste Series, which includes Indium8.9HFA and Indium8.9HF-1. These Pb-free and halogen-free solder pastes eliminate graping, head-in-pillow, and QFN defects.

07/10/2012

Research Metallurgist Weiping Liu was recognized for "Best Soldering Paper" at International Brazing and Soldering Conference (IBSC), hosted by ASM International & American Welding Society 4/22/2012 in Las Vegas

05/16/2012

Indium Corporation was recognized for its strong support of SMTA China at their Annual Recognition Ceremony held during NEPCON China in Shanghai.

04/11/2012

Eric Slezak will serve as Plenary Speaker at the 5th International Brazing and Soldering Conference, April 22-25, 2012, in Las Vegas, Nevada. Eric will present Shaping the Future Solder Industry

03/08/2012

Technical Manager for Europe, Karthik Vijay will present his technical findings at IMAPS-UK RaMP RF and Microwave Packaging workshop on March 21 in Edinburgh, Scotland.

03/02/2012

Indium Corporation's Robert Ploessl, PhD, will present at IMAPS International Conference on Device Packaging March 6-8, 2012 in Scottsdale/Fountain Hills, Arizona.