Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, will deliver a technical presentation at the IMAPS Autumn Conference on Oct. 20-21 in Munich, Germany.
Indium Corporation’s Ivan Castellanos, Technical Services Manager, Latin America, recently hosted the highest-attended SMT Processes Certification course ever, with 34 attendees.
Indium Corporation was presented with the Global Technology Award for Solder Paste for Indium10.1HF Solder Paste at SMTA International (SMTAI) Conference in Rosemont, Ill.
Indium Corporation’s Jason Chou, Area Technical Manager for Taiwan, and Kenny Chiong, Senior Technical Support Engineer, will present at 2016 Electronics Packaging Technology Conference (EPTC) on Nov. 30-Dec. 3 in Suntec City, Singapore.
Indium Corporation's newest informational video provides an overview of the versatility of indium when alloyed with other metals.
Jonas Sjoberg, Technical Manager, will present DfX for High-Density Assemblies, which covers the basic principles and understanding of manufacturability (DfM) and reliability (DfR).
Several Indium Corporation experts will share their knowledge and expertise at IMAPS 49th International Symposium on Microelectronics (IMAPS 2016 - Packaging the Connected World), Oct. 10-13, in Pasadena, Calif.
Several Indium Corporation experts will share their knowledge and expertise at the SMTA International Conference Sept. 25-29 in Rosemont, Ill.
Indium Corporation, the industry leader for void-reducing solutions, will chair a special session focusing on void reduction in bottom-terminated components (BTCs) at the SMTA International Conference on Sept. 29 in Rosemont, Ill.
Indium Corporation’s Sze Pei Lim, Semiconductor Product Manager – Asia, will present at the 13th International Wafer-Level Packaging Conference (IWLPC 2016 – Bridging the Interconnect Gap), Oct. 18-20, in San Jose, Calif.
Indium Corporation experts will deliver several technical presentations at the 37th International Electronics Manufacturing Technology and 18th Electronics Material & Packaging Conference (IEMT-EMAP 2016), Sept. 20-22, in Penang, Malaysia
Indium Corporation will feature its reinforced indium and solder alloy fabrications, InFORMS®, at IMAPS 49th International Symposium on Microelectronics (IMAPS 2016 - Packaging the Connected World), Oct. 10-13, in Pasadena, Calif.
The Annual Perfect Quality Award was presented to Ross Berntson, Indium Corporation Executive Vice President, at ON Semiconductor’s Supplier Executive Conference on June 8, in Phoenix, Ariz.
Indium Corporation's new reclaim and recycle program is now offering customers credit for their solder pot dross and contaminated solder.
Indium Corporation's indium tin oxide (ITO) and indium gallium zinc oxide (IGZO) reclaim and recycle program enables customers to earn a greater return on production materials.
Indium Corporation, the industry-leading source of void-reducing materials and results, has specifically formulated Indium10.1 Solder Paste to reduce voiding significantly below the industry average – for improved finished goods reliability
Indium is used extensively in thermal management, low-temperature soldering, and sealing applications. In many instances, the indium is not fully consumed and can be reclaimed from the process.
Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, named to the International Microelectronics Assembly and Packaging Society (IMAPS) Global Business Council Steering Committee.
Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will chair the professional development course, Materials Considerations for Achieving High Reliability Lead-Free Soldering, at (ECTC),
Indium Corporation’s Eric Bastow, Assistant Technical Manager, has become one of only a handful of technologists to earn a re-certification of the Surface Mount Technology Association’s (SMTA) SMT Processes designation.
Indium Corporation's germanium reclaim and recycle program enables customers to increase their return on materials by providing credit for diverting spent germanium from the waste stream.
Dr. Lee’s webtorial, Low-Temperature Solders: New Developments and Applications, will cover varieties of low-temperature solders with emphasis on lead-free alloys, their physical, mechanical, and soldering properties, and their applications.
Karch provides support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials, including solder paste, solder preforms, fluxes, and thermal management materials.
Indium Corporation’s Kenneth Thum, Senior Technical Support Engineer, will present Risk of No-Clean Flux Not Fully Dried Under Component Terminations at IPC Thailand on April 26 in Bangkok, Thailand.
Indium Corporation announces the release of Indium10.2HF, a halogen- and Pb-free, no-clean solder paste that is specifically formulated to address in-circuit testing challenges.
Hults works closely with other members of the Indium Corporation team to coordinate global resources that enhance relationships. He also develops and executes strategies that nurture existing accounts and encourage the growth of new business.
Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.
Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present a two-part workshop at SMT Hybrid Packaging 2016, on April 26-28 in Nuremberg, Germany.
Manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs. Indium Corp. will help customers Avoid the Void™ with its void-reducing no-clean solder pastes at IPC APEX Expo on March 15-17 in Las Vegas.
Indium Corporation has been named winner of the annual CIRCUITS ASSEMBLY Service Excellence Award for Materials at IPC APEX Expo on March 15 in Las Vegas, Nev
Indium Corporation will be running its low-voiding solder products “Live@APEX” in partner booths throughout IPC APEX Expo onMarch 15-17 in Las Vegas, Nev.
Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at SEMICON China on March 14, 2016, in Shanghai, China.
Indium Corporation announces the promotions of Sze Pei Lim to Regional Product Manager for Semiconductor Products in Asia and Jonas Sjoberg to Technical Manager for Asia.
Indium Corporation’s Wolfgang Bloching, Regional Sales Manager – Germany, Austria, and Switzerland, will present at the EPP Innovations Forum on March 10 in Böblingen, Germany.
Indium Corporation announces the release of PoP Flux 89LV-P, a bright pink-colored, no-clean, thixotropic flux helps engineers Avoid the Void™ by greatly improving visual inspection to minimize voiding and other defects in package-on-package applications.
Indium Corporation will feature “Power-Safe” NC-SMQ®75, world’s first and only die-attach solder paste suitable for non-cleaned clip bond applications power semiconductor die-attach applications, SEMICON China March 15-17, 2016, in Shanghai, China.
Indium Corporation will feature Indium3.2HF water-soluble solder paste at Productronica China on March 15-17, 2016, at the Shanghai New International Expo Centre in Shanghai, China.
Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will present at the IPC APEX Expo technical conference on March 13-17 in Las Vegas, Nev.
Indium Corporation's Indium8.9HF is a halogen-free, no-clean solder paste that is specifically formulated to Avoid the Void™, while delivering high transfer efficiency with low variability.
Indium Corporation will feature Heat-Spring®, a compressible, recyclable, metal thermal interface material, at Strategies in Light on March 1-3 in Santa Clara, Calif.
Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo, which will be held on March 15-17 in Las Vegas, Nev.
Indium Corporation will feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016, Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical.
Indium Corporation will feature its reinforced indium and solder alloy fabrications InFORMS® at NEPCON Japan, Jan. 13-15 in Tokyo, Japan.
Indium Corporation was presented with the Global Technology Award for Best Products – Americas for InFORMS® high-reliability solder preforms, on Nov. 10 at Productronica in Munich, Germany.
Traditional gallium trichloride is solid at room temperature and often forms clumps or sticks together during storage and use. This inhibits the efficient and consistent materials transfer between vessels and processing equipment.
Vareha-Walsh brings extensive metals market experience from her previous roles, including Director of Global Procurement, Director of Metallurgical Procurement, Plant Controller, and Global Business Manager.
Indium Corporation announces the release of its newest informational video that describes how solder preforms can reduce voiding in bottom termination components.
Indium Corporation announces the release of its newest informational video that provides real-world examples of how solder materials performance affects electronics manufacturing productivity and profitability
Indium Corporation will feature void-reducing Indium8.9HF, a halogen-free, no-clean solder paste, at Productronica 2015, Nov. 10-13, in Munich, Germany.
Indium Corporation announces the release of its newest informational video detailing the benefits of using low-temperature solder alloy systems based on indium and bismuth.
Indium Corporation announces the release of its newest informational video that guides the audience on the proper steps for selecting a solder preform.
Indium Corporation announces the release of its newest informational video that discusses InFORMS®, a revolutionary product designed to achieve uniform bondline thickness for a stronger final solder joint.
Indium Corporation announces the release of its newest informational video that provides real-world examples of drastic improvements of electronics manufacturing uptime and productivity.
Indium Corporation's Tim Jensen, Senior Product Manager for Engineered Solders, will lead a professional development course at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26, in Orlando, Fla
Indium Corporation announces a soft metal alloy thermal interface material (SMA TIM) that offers high and uniform thermal resistance at lower applied stresses in compressed interfaces.
Indium Corporation announces the release of its newest technology publication, SMT with Phil Zarrow, authored by SMT expert Phil Zarrow, President and Principal Consultant for ITM Consulting.
Several Indium Corporation experts will share their knowledge and expertise at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26-29, in Orlando, Fla.
Indium Corporation’s Indium6.4R is a versatile, water-soluble solder paste flux that enables a low cost of ownership for PCB assembly customers through an all-around, balanced performance.
Indium Corporation's Sze Pei Lim, Technical Manager for Southeast Asia, will present at the Microelectronics Tech Asia Singapore Conference on Sept. 28-29 in Singapore.
Indium Corporation's Claire Mikolajczak, Director, Metals & Chemicals, will share her expertise at the EU Critical Raw Materials: Essential for Your Business and Your Industry Now and in the Future, Sept. 16 in Stuttgart, Germany.
Indium Corporation announces that several company technologists have earned their designation as SMTA-Certified Process Engineers, further expanding the largest SMTA-certified engineering team in the industry.
Indium Corporation is celebrating 20 years of service and supply from its Asia-Pacific operations to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Based in Singapore, the facility serves customers worldwide.
Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present at ICEPT 2015, August 11-14 in Changsha, China.
Indium Corporation’s Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at European Power Electronics and Drives’s (EPE) 17th Conference on Power Electronics and Applications, Sept. 8-10 in Geneva, Switzerland.
Indium Corporation announces a new solder paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications.
Indium Corporation was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12.
Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, and Dr. Ron Lasky, Senior Technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in Milpitas, California.
ndium Corporation’s Brook Sandy-Smith, Product Specialist for PCB Assembly Materials, was presented with a Distinguished Committee Service Award by the IPC at SMTA International in Fort Worth, Texas on October 15.
Indium Corporation will feature its new technology platform using the SACM™ Solder Alloy at Productronica November 12-15 in Münich, Germany.
Indium Corporation continues to expand its existing line of solder products to provide customers with a consistent and reliable supply of soldering materials, thereby allowing customers to consolidate sources, reduce cost, and increase reliability.
Indium Corporation was awarded the first IPC J-STD-004 Qualified Products Listing (QPL) certificate by the IPC Association at the fall IPC Standards Development Committee Meetings.
Indium Corporation hosted 45 students and teachers from Herkimer BOCES on October 8 as part of their celebration of National Manufacturing Day.
LV1000 reduces false failures while increasing productivity, throughput yields, and component performance.
Indium Corporation is celebrating National Manufacturing Day, Oct 4, with a variety of activities intended to promote STEM (science, technology, engineering, & math) education & career opportunities in advanced manufacturing in the Mohawk Valley.
Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, will present at the 2013 Electronics Packaging Symposium October 15-16 at Binghamton University in Binghamton, New York.
Several Indium Corporation technology experts will present at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) on October 15-17 in Fort Worth, Texas
Gold-based solders provide superior thermal fatigue resistance, resistance to corrosion, & the highest tensile strength of any solder. Indium Corpwill feature high-reliability gold-based solders at IMAPS Sept 30 – Oct 3 in Orlando, Florida
Indium Corporation technology experts will share their technical expertise at the IPC APEX Expo February 19-21 in San Diego, California.
The School and Business Alliance, a service of Oneida-Herkimer-Madison BOCES, assists students in making successful transitions from school to careers, and supports the development of a qualified workforce in the Mohawk Valley.
Indium Corporation’s Technical Manager for European Operations Karthik Vijay will present at two upcoming technical conferences in the United Kingdom and the Netherlands.
Indium's gold-based solder alloys provide reliable joint strength & superior thermal conductivity, especially as compared to standard SnPb or SAC solders. IMAPS is 9/9-9/13 in San Diego
Indium Senior Technical Support Engineer Mario Scalzo will present "The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes" at IPC Midwest Conference & Exhibition 8/23/12
Indium Corporation introduces the Indium8.9 Solder Paste Series, which includes Indium8.9HFA and Indium8.9HF-1. These Pb-free and halogen-free solder pastes eliminate graping, head-in-pillow, and QFN defects.
Research Metallurgist Weiping Liu was recognized for "Best Soldering Paper" at International Brazing and Soldering Conference (IBSC), hosted by ASM International & American Welding Society 4/22/2012 in Las Vegas
Indium Corporation was recognized for its strong support of SMTA China at their Annual Recognition Ceremony held during NEPCON China in Shanghai.
Eric Slezak will serve as Plenary Speaker at the 5th International Brazing and Soldering Conference, April 22-25, 2012, in Las Vegas, Nevada. Eric will present Shaping the Future Solder Industry
Technical Manager for Europe, Karthik Vijay will present his technical findings at IMAPS-UK RaMP RF and Microwave Packaging workshop on March 21 in Edinburgh, Scotland.
Indium Corporation's Robert Ploessl, PhD, will present at IMAPS International Conference on Device Packaging March 6-8, 2012 in Scottsdale/Fountain Hills, Arizona.
Indium Corporation Product Manager of PCB Assembly Materials Tim Jensen will present Material and Process Optimization for Head-in-Pillow Elimination as part of SMTA's webinar series January 12, 2012, from 11 a.m. to 12:30 p.m.
Soldering in the Age of 3D Semiconductor Assembly discusses usage of solder & flux in advanced technologies, focusing on complex processes where solder is adjacent to the die surface Read more: http://www.indium.com/news/Arizona-Sonora/#ixzz1jBtKR712
Product Manager of PCB Assembly Materials Tim Jensen will present Lead-Free Assembly for High Yields and Reliability as part of SMTA's webtorial series on December 6 and 13, 2011, from 1 to 2:30 p.m.
Indium Corporation experts will present technical findings at IPC Midwest Conference & Exhibition, September 21-22, 2011, in Schaumburg, Illinois.
Indium Corporation expert Dr. Ning-Cheng Lee will present his technical findings at the 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2011) August 8-11, in Shanghai, China.
Technical Manager for Europe, Karthik Vijay , will present his technical findings at IMAPS-UK RaMP RF and Microwave Packaging workshop on March 21 in Edinburgh, Scotland.
Karthik Vijay will present Engineered Solders in RF & Microwave Packages. This paper discusses how engineering unique attributes into solder preforms exponentially increases the reliability and manufacturing windows of RF and microwave packages.
The kits, which contain common sized tabbing and bus ribbon and fluxes, are available in three versions, including one with a uniquely designed Pb-free, bismuth-containing, low-temperature coating.
Indium earned the award for the material Heat-Spring. It is a clean, high-performance thermal solution for the increasing demands of high brightness LEDs Read more: http://www.indium.com/news/innova_award/#ixzz0r995GDEd Read more:
Indium Corporation announces the signing of a joint marketing and technical support agreement for high-temperature Pb-free electronics assembly materials patented and manufactured by Ormet Circuits, Inc.
Andy Mackie, Tim Jensen and Jim Hisert will be hosting a panel discussion at GlobalSpec's virtual event "Electronic Product Design" addressing Halogen Free, Pb-Free and Photovoltaics
Blogs have become a standard way for b-to-b companies to reach constituents with specific interests, but electronics assembly materials company Indium Corp. has recently taken the concept to a new level.
Indium Corporation's Director of Metals & Chemicals, Claire Mikolajczak, is presenting at the Sustainability Summit 3-5 November in Milan, Italy
Indium Corporation's Global Product Manager, Andy C. Mackie, Ph. D., MSc, is presenting at the International Wafer-Level Packaging Conference (IWLPC) October 27-30, 2009 in Santa Clara, CA.
Five of Indium Corporation's technology experts will be presenting their technical findings at SMTA International (SMTAI), October 4 - 8, 2009, at The Town and Country Resort and Convention Center, San Diego, CA.
Indium Corporation (Indium) of Clinton, NY, today announced that it has acquired the processes, equipment, and know-how of Reactive NanoTechnologies, Inc. (RNT), developer and manufacturer of NanoFoil®.
Indium Corporation announced that it has acquired the processes, equipment, and know-how of Reactive NanoTechnologies, Inc. (RNT), developer and manufacturer of NanoFoil®. Indium will move the RNT operation and a core staff into its Utica Business Park
Indium Corporation announces the Heat-Spring® metallic thermal interface material (TIM) specifically designed and optimized for use with Infineon Technologies AG PrimePACKTM IGBT modules
For the paper "Fine Powder Solder Pastes: Stencil Printing and Reflow in Lead-Free Assembly" presented at SMTA Toronto, April 2008