01/30/2014

Indium Corporation announces a new solder paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications.

11/13/2013

Indium Corporation was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12.

11/05/2013

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, and Dr. Ron Lasky, Senior Technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in Milpitas, California.

11/01/2013

ndium Corporation’s Brook Sandy-Smith, Product Specialist for PCB Assembly Materials, was presented with a Distinguished Committee Service Award by the IPC at SMTA International in Fort Worth, Texas on October 15.

10/29/2013

Indium Corporation will feature its new technology platform using the SACM™ Solder Alloy at Productronica November 12-15 in Münich, Germany.

10/24/2013

Indium Corporation continues to expand its existing line of solder products to provide customers with a consistent and reliable supply of soldering materials, thereby allowing customers to consolidate sources, reduce cost, and increase reliability.

10/22/2013

Indium Corporation was awarded the first IPC J-STD-004 Qualified Products Listing (QPL) certificate by the IPC Association at the fall IPC Standards Development Committee Meetings.

10/17/2013

Indium Corporation hosted 45 students and teachers from Herkimer BOCES on October 8 as part of their celebration of National Manufacturing Day.

10/10/2013

LV1000 reduces false failures while increasing productivity, throughput yields, and component performance.

10/03/2013

Indium Corporation is celebrating National Manufacturing Day, Oct 4, with a variety of activities intended to promote STEM (science, technology, engineering, & math) education & career opportunities in advanced manufacturing in the Mohawk Valley.

10/01/2013

Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, will present at the 2013 Electronics Packaging Symposium October 15-16 at Binghamton University in Binghamton, New York.

09/26/2013

Several Indium Corporation technology experts will present at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) on October 15-17 in Fort Worth, Texas

09/24/2013

Gold-based solders provide superior thermal fatigue resistance, resistance to corrosion, & the highest tensile strength of any solder. Indium Corpwill feature high-reliability gold-based solders at IMAPS Sept 30 – Oct 3 in Orlando, Florida

01/30/2013

Indium Corporation technology experts will share their technical expertise at the IPC APEX Expo February 19-21 in San Diego, California.

12/13/2012

The School and Business Alliance, a service of Oneida-Herkimer-Madison BOCES, assists students in making successful transitions from school to careers, and supports the development of a qualified workforce in the Mohawk Valley.

09/13/2012

Indium Corporation’s Technical Manager for European Operations Karthik Vijay will present at two upcoming technical conferences in the United Kingdom and the Netherlands.

08/16/2012

Indium's gold-based solder alloys provide reliable joint strength & superior thermal conductivity, especially as compared to standard SnPb or SAC solders. IMAPS is 9/9-9/13 in San Diego

08/14/2012

Indium Senior Technical Support Engineer Mario Scalzo will present "The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes" at IPC Midwest Conference & Exhibition 8/23/12

08/03/2012

Indium Corporation introduces the Indium8.9 Solder Paste Series, which includes Indium8.9HFA and Indium8.9HF-1. These Pb-free and halogen-free solder pastes eliminate graping, head-in-pillow, and QFN defects.

07/10/2012

Research Metallurgist Weiping Liu was recognized for "Best Soldering Paper" at International Brazing and Soldering Conference (IBSC), hosted by ASM International & American Welding Society 4/22/2012 in Las Vegas

05/16/2012

Indium Corporation was recognized for its strong support of SMTA China at their Annual Recognition Ceremony held during NEPCON China in Shanghai.

04/11/2012

Eric Slezak will serve as Plenary Speaker at the 5th International Brazing and Soldering Conference, April 22-25, 2012, in Las Vegas, Nevada. Eric will present Shaping the Future Solder Industry

03/08/2012

Technical Manager for Europe, Karthik Vijay will present his technical findings at IMAPS-UK RaMP RF and Microwave Packaging workshop on March 21 in Edinburgh, Scotland.

03/02/2012

Indium Corporation's Robert Ploessl, PhD, will present at IMAPS International Conference on Device Packaging March 6-8, 2012 in Scottsdale/Fountain Hills, Arizona.

12/08/2011

Indium Corporation Product Manager of PCB Assembly Materials Tim Jensen will present Material and Process Optimization for Head-in-Pillow Elimination as part of SMTA's webinar series January 12, 2012, from 11 a.m. to 12:30 p.m.

12/02/2011

Soldering in the Age of 3D Semiconductor Assembly discusses usage of solder & flux in advanced technologies, focusing on complex processes where solder is adjacent to the die surface Read more: http://www.indium.com/news/Arizona-Sonora/#ixzz1jBtKR712

11/15/2011

Product Manager of PCB Assembly Materials Tim Jensen will present Lead-Free Assembly for High Yields and Reliability as part of SMTA's webtorial series on December 6 and 13, 2011, from 1 to 2:30 p.m.

08/24/2011

Indium Corporation experts will present technical findings at IPC Midwest Conference & Exhibition, September 21-22, 2011, in Schaumburg, Illinois.

08/01/2011

Indium Corporation expert Dr. Ning-Cheng Lee will present his technical findings at the 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2011) August 8-11, in Shanghai, China.

03/08/2011

Technical Manager for Europe, Karthik Vijay , will present his technical findings at IMAPS-UK RaMP RF and Microwave Packaging workshop on March 21 in Edinburgh, Scotland.

03/07/2011

Karthik Vijay will present Engineered Solders in RF & Microwave Packages. This paper discusses how engineering unique attributes into solder preforms exponentially increases the reliability and manufacturing windows of RF and microwave packages.

06/30/2010

The kits, which contain common sized tabbing and bus ribbon and fluxes, are available in three versions, including one with a uniquely designed Pb-free, bismuth-containing, low-temperature coating.

05/21/2010

Indium earned the award for the material Heat-Spring. It is a clean, high-performance thermal solution for the increasing demands of high brightness LEDs Read more: http://www.indium.com/news/innova_award/#ixzz0r995GDEd Read more:

04/22/2010

Indium Corporation announces the signing of a joint marketing and technical support agreement for high-temperature Pb-free electronics assembly materials patented and manufactured by Ormet Circuits, Inc.

12/09/2009

Andy Mackie, Tim Jensen and Jim Hisert will be hosting a panel discussion at GlobalSpec's virtual event "Electronic Product Design" addressing Halogen Free, Pb-Free and Photovoltaics

12/08/2009

Blogs have become a standard way for b-to-b companies to reach constituents with specific interests, but electronics assembly materials company Indium Corp. has recently taken the concept to a new level.

10/27/2009

Indium Corporation's Director of Metals & Chemicals, Claire Mikolajczak, is presenting at the Sustainability Summit 3-5 November in Milan, Italy

10/13/2009

Indium Corporation's Global Product Manager, Andy C. Mackie, Ph. D., MSc, is presenting at the International Wafer-Level Packaging Conference (IWLPC) October 27-30, 2009 in Santa Clara, CA.

10/04/2009

Five of Indium Corporation's technology experts will be presenting their technical findings at SMTA International (SMTAI), October 4 - 8, 2009, at The Town and Country Resort and Convention Center, San Diego, CA.

09/22/2009

Indium Corporation (Indium) of Clinton, NY, today announced that it has acquired the processes, equipment, and know-how of Reactive NanoTechnologies, Inc. (RNT), developer and manufacturer of NanoFoil®.

09/22/2009

Indium Corporation announced that it has acquired the processes, equipment, and know-how of Reactive NanoTechnologies, Inc. (RNT), developer and manufacturer of NanoFoil®. Indium will move the RNT operation and a core staff into its Utica Business Park

09/09/2009

Indium Corporation announces the Heat-Spring® metallic thermal interface material (TIM) specifically designed and optimized for use with Infineon Technologies AG PrimePACKTM IGBT modules

05/26/2009

For the paper "Fine Powder Solder Pastes: Stencil Printing and Reflow in Lead-Free Assembly" presented at SMTA Toronto, April 2008