Indium Corporation announces a new solder paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications.
Indium Corporation was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12.
Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, and Dr. Ron Lasky, Senior Technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in Milpitas, California.
ndium Corporation’s Brook Sandy-Smith, Product Specialist for PCB Assembly Materials, was presented with a Distinguished Committee Service Award by the IPC at SMTA International in Fort Worth, Texas on October 15.
Indium Corporation will feature its new technology platform using the SACM™ Solder Alloy at Productronica November 12-15 in Münich, Germany.
Indium Corporation continues to expand its existing line of solder products to provide customers with a consistent and reliable supply of soldering materials, thereby allowing customers to consolidate sources, reduce cost, and increase reliability.
Indium Corporation was awarded the first IPC J-STD-004 Qualified Products Listing (QPL) certificate by the IPC Association at the fall IPC Standards Development Committee Meetings.
Indium Corporation hosted 45 students and teachers from Herkimer BOCES on October 8 as part of their celebration of National Manufacturing Day.
LV1000 reduces false failures while increasing productivity, throughput yields, and component performance.
Indium Corporation is celebrating National Manufacturing Day, Oct 4, with a variety of activities intended to promote STEM (science, technology, engineering, & math) education & career opportunities in advanced manufacturing in the Mohawk Valley.
Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, will present at the 2013 Electronics Packaging Symposium October 15-16 at Binghamton University in Binghamton, New York.
Several Indium Corporation technology experts will present at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) on October 15-17 in Fort Worth, Texas
Gold-based solders provide superior thermal fatigue resistance, resistance to corrosion, & the highest tensile strength of any solder. Indium Corpwill feature high-reliability gold-based solders at IMAPS Sept 30 – Oct 3 in Orlando, Florida
Indium Corporation technology experts will share their technical expertise at the IPC APEX Expo February 19-21 in San Diego, California.
The School and Business Alliance, a service of Oneida-Herkimer-Madison BOCES, assists students in making successful transitions from school to careers, and supports the development of a qualified workforce in the Mohawk Valley.
Indium Corporation’s Technical Manager for European Operations Karthik Vijay will present at two upcoming technical conferences in the United Kingdom and the Netherlands.
Indium's gold-based solder alloys provide reliable joint strength & superior thermal conductivity, especially as compared to standard SnPb or SAC solders. IMAPS is 9/9-9/13 in San Diego
Indium Senior Technical Support Engineer Mario Scalzo will present "The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes" at IPC Midwest Conference & Exhibition 8/23/12
Indium Corporation introduces the Indium8.9 Solder Paste Series, which includes Indium8.9HFA and Indium8.9HF-1. These Pb-free and halogen-free solder pastes eliminate graping, head-in-pillow, and QFN defects.
Research Metallurgist Weiping Liu was recognized for "Best Soldering Paper" at International Brazing and Soldering Conference (IBSC), hosted by ASM International & American Welding Society 4/22/2012 in Las Vegas
Indium Corporation was recognized for its strong support of SMTA China at their Annual Recognition Ceremony held during NEPCON China in Shanghai.
Eric Slezak will serve as Plenary Speaker at the 5th International Brazing and Soldering Conference, April 22-25, 2012, in Las Vegas, Nevada. Eric will present Shaping the Future Solder Industry
Technical Manager for Europe, Karthik Vijay will present his technical findings at IMAPS-UK RaMP RF and Microwave Packaging workshop on March 21 in Edinburgh, Scotland.
Indium Corporation's Robert Ploessl, PhD, will present at IMAPS International Conference on Device Packaging March 6-8, 2012 in Scottsdale/Fountain Hills, Arizona.
Indium Corporation Product Manager of PCB Assembly Materials Tim Jensen will present Material and Process Optimization for Head-in-Pillow Elimination as part of SMTA's webinar series January 12, 2012, from 11 a.m. to 12:30 p.m.
Soldering in the Age of 3D Semiconductor Assembly discusses usage of solder & flux in advanced technologies, focusing on complex processes where solder is adjacent to the die surface Read more: http://www.indium.com/news/Arizona-Sonora/#ixzz1jBtKR712
Product Manager of PCB Assembly Materials Tim Jensen will present Lead-Free Assembly for High Yields and Reliability as part of SMTA's webtorial series on December 6 and 13, 2011, from 1 to 2:30 p.m.
Indium Corporation experts will present technical findings at IPC Midwest Conference & Exhibition, September 21-22, 2011, in Schaumburg, Illinois.
Indium Corporation expert Dr. Ning-Cheng Lee will present his technical findings at the 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2011) August 8-11, in Shanghai, China.
Technical Manager for Europe, Karthik Vijay , will present his technical findings at IMAPS-UK RaMP RF and Microwave Packaging workshop on March 21 in Edinburgh, Scotland.
Karthik Vijay will present Engineered Solders in RF & Microwave Packages. This paper discusses how engineering unique attributes into solder preforms exponentially increases the reliability and manufacturing windows of RF and microwave packages.
The kits, which contain common sized tabbing and bus ribbon and fluxes, are available in three versions, including one with a uniquely designed Pb-free, bismuth-containing, low-temperature coating.
Indium earned the award for the material Heat-Spring. It is a clean, high-performance thermal solution for the increasing demands of high brightness LEDs Read more: http://www.indium.com/news/innova_award/#ixzz0r995GDEd Read more:
Indium Corporation announces the signing of a joint marketing and technical support agreement for high-temperature Pb-free electronics assembly materials patented and manufactured by Ormet Circuits, Inc.
Andy Mackie, Tim Jensen and Jim Hisert will be hosting a panel discussion at GlobalSpec's virtual event "Electronic Product Design" addressing Halogen Free, Pb-Free and Photovoltaics
Blogs have become a standard way for b-to-b companies to reach constituents with specific interests, but electronics assembly materials company Indium Corp. has recently taken the concept to a new level.
Indium Corporation's Director of Metals & Chemicals, Claire Mikolajczak, is presenting at the Sustainability Summit 3-5 November in Milan, Italy
Indium Corporation's Global Product Manager, Andy C. Mackie, Ph. D., MSc, is presenting at the International Wafer-Level Packaging Conference (IWLPC) October 27-30, 2009 in Santa Clara, CA.
Five of Indium Corporation's technology experts will be presenting their technical findings at SMTA International (SMTAI), October 4 - 8, 2009, at The Town and Country Resort and Convention Center, San Diego, CA.
Indium Corporation (Indium) of Clinton, NY, today announced that it has acquired the processes, equipment, and know-how of Reactive NanoTechnologies, Inc. (RNT), developer and manufacturer of NanoFoil®.
Indium Corporation announced that it has acquired the processes, equipment, and know-how of Reactive NanoTechnologies, Inc. (RNT), developer and manufacturer of NanoFoil®. Indium will move the RNT operation and a core staff into its Utica Business Park
Indium Corporation announces the Heat-Spring® metallic thermal interface material (TIM) specifically designed and optimized for use with Infineon Technologies AG PrimePACKTM IGBT modules
For the paper "Fine Powder Solder Pastes: Stencil Printing and Reflow in Lead-Free Assembly" presented at SMTA Toronto, April 2008