Master Bond, Inc.
Developed for potting, sealing, encapsulation and casting applications, Master Bond EP110F8-5 is dimensionally stable and has low shrinkage upon cure.
Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications.
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for bonding and sealing.
Master Bond X21Med is a one part system that can be used for bonding and priming polyolefinic surfaces.
Two component epoxy system meets Airbus standards
Master Bond EP62-1BF protects against many aggressive chemicals, even at elevated temperatures.
Master Bond EP30LP-2 is a two component epoxy with a low viscosity and a volume resistivity of over 1014 ohm-cm, making it well suited for potting and encapsulation applications. This high performance system can also be used for bonding and sealing.
Formulated for use in demanding thermal management applications, Master Bond EP30TC is a two component epoxy that contains a robust thermally conductive filler with very fine particle sizes.
Master Bond EP3HTND-2Med Black is a high strength, fast curing epoxy for use in the assembly of medical devices.
Certified to meet ASTM E595 NASA low outgassing standards, Master Bond EP46HT-2AO Black is well suited for the aerospace, electronic, opto-electronic industries and can be used vacuum environments.
Master Bond X5TC is an elastomeric system that has a thermal conductivity of 10-12 BTU•in/ft2•hr•°F [1.44-1.73 W/m•K] while maintaining solid electrical insulation properties.
Widely used in the electronic, aerospace, optical and specialty OEM industries, Master Bond EP126 excels in high temperature applications up to +600°F.
Formulated for specific optical applications, Master Bond EP30-2LB blocks UV light from 200-400 nm and allows the transmission of visible light from 450-900 nm.
Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications.
Formulated for bonding, sealing, coating and encapsulation applications, Master Bond EP41S-5 is a room temperature curing epoxy that combines a high strength profile, superior electrical insulation values and exceptional chemical resistance.
Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W.
Master Bond UV22DC80 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating with the ability to cure under UV light and/or with heat.
Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications.
Master Bond EP113 is a nanosilica filled epoxy that delivers enhanced dimensional stability and exceptionally low shrinkage upon curing.
Master Bond Supreme 45HTQ-4 is a two component, toughened, silicon carbide filled epoxy for high performance bonding, sealing and casting.
Master Bond Supreme 18TC is a cutting edge material pertaining to the thermal management of epoxies.
Developed for high tech bonding and sealing applications, Master Bond Supreme 11HTLP is a two part epoxy that combines user friendly processing with a high physical strength profile.
MasterSil 972TC-LO is capable of transferring heat while retaining superior dielectric properties. It passes the rigorous requirements for low outgassing per ASTM E595 specifications.
Master Bond UV15DC80Med is a special dual cure epoxy based system that offers a primary cure using UV light along with a secondary heat curing mechanism. This extraordinary compound also meets USP Class VI specifications and passes ISO 10993-5 testing.
One component epoxy system for potting, encapsulation, bonding and sealing applications with a curing temperature of 200-220°F or higher.
One part, fluorosilicone system for high performance bonding, sealing & coating with enhanced chemical resistance
Master Bond EP21NDCL is a unique two component epoxy system that cures optically clear in thin sections, even though Part A is translucent and Part B is light amber.
One component epoxy system for bonding, sealing, potting and encapsulation applications featuring curing temperatures of 175-180°F or higher.
Widely used for applications in the aerospace, electronic and OEM industries, Master Bond EP121CL-LO is a high performance epoxy that passes ASTM E595 testing for NASA low outgassing specifications.
Serviceable up to +500°F, EP13SPND-2 is a one part epoxy paste for structural bonding applications.
MasterSil 912Med is a specially formulated RTV silicone system for bonding, sealing and coating primarily for medical devices.
Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)].
Master Bond Supreme 10HTF-1 combines very fast curing and simple handling properties with a superior performance profile. It has a smooth paste consistency and is easy to apply.
Master Bond EP48TC is a breakthrough material pertaining to thermal management applications of epoxies. It utilizes a unique combination of special high thermal conductive fillers and is capable of being applied in bond lines as thin as 10-15 microns.
MasterSil 920-LO is a specialty type, high performance, RTV silicone for sealing, coating and small encapsulations.
Two component epoxy system meeting FAR standard 14 CFR 25.853(a) for flame retardancy
Featuring an exceedingly low coefficient of thermal expansion of 9-12 x 10-6 in/in/°C, EP42HT-2LTE is a two component epoxy for bonding, sealing, coating and select casting applications.
Two component, high performance epoxy system features convenient handling along with excellent temperature and chemical resistance.
Combining the benefits of epoxy resins and polyurethanes, Master Bond Polymer System EP30D-7 offers superior strength, flexibility, abrasion resistance and toughness.