Interplex Etch Logic provides high-strength metal filters and metal filtration screens with consistent open-area. Interplex's reel-to-reel process creates some of the most complex features with the highest degree of repeatability and consistency.
Our filtration products are used successfully worldwide in thousands of demanding applications. (read more)
This Solder Bearing Lead (SBL) Tech Bulletin provides background on SBL Technology along with an overview of the key considerations to keep in mind when implementing SBL applications. It also discusses the “Claw” edge clip design. (read more)
Designed to support high-power and harsh environmental applications, Interplex's new IDC family of terminals work directly with heavier, multi-layer magnet wire coatings while maintaining a high normal force and a low contact resistance. (read more)
With a rapidly expanding range of industries now relying on solder-free Press-Fit technology as a key lynchpin in their electronics assembly strategies, it has become increasingly important for suppliers of compliant Press-Fit interconnects to provide stringently controlled testing, qualification and manufacturing processes. (read more)
Electronic Modules and Packaging Solutions
Mechatronics - the combination of mechanical and electronic principals to create complex stamped, plated and molded modules and assemblies.
Interplex offers complete solutions from concept through development and into scalable high-volume production for almost any MECHATRONIC packaging application. Inter... (read more)
Interplex Engineered Products (IEP) is a turnkey vertically integrated world-class supplier of application specific open cavity thermoplastic semi-conductor and Electronic Packages across all major markets. (read more)
Wire-bondable plating is a key process step in the manufacturing of all types of semiconductor packages including Integrated Connector Package Modules such as MEMS housings, sensors, LEDs, and Solar and Power Electronic modules. Successful bonding of aluminum or gold wire to an interconnect module lead-frame requires a plated surface with the highest level of material surface quality. (read more)
This Interplex Press-Fit Tech Bulletin discusses the current carrying capacity for Press-Fit applications, especially in high-power applications.
The specific three topics in this series are:
• Application requirements for higher current capabilities
• Current capability testing and results
• Special design considerations for power m... (read more)
Interplex Etch Logic's Reel-to-Reel Chemical Etching process is capable of developing sharp point combinations that are suitable for many intended medical applications.
Strong, sharp tapered points are ideal for even the most difficult punctures and small incisions.
(read more)
Interplex Industries' innovative solder bearing leads and flux bearing leads were developed to help overcome significant challenges in circuit assembly eliminating costly and secondary soldering operations. This Solder bearing and Flux bearing lead technology attaches a precise amount of solder and flux on each contact that can be easily reflowed. (read more)
Driven by the explosive growth of automotive electrical systems and many other industries using inverter and converter based power modules, press-fit technologies have become the preferred alternative for delivering highly reliable, solderless interconnect solutions. (read more)
Interplex's SMT Card-Edge contacts can be placed on a daughter card using standard high-speed pick and place surface mount equipment. The Surface Mount Device (SMD) solder interface utilizes pin in paste through-hole technology as well as recessed channels for improved solder distribution which allows for high mechanical strength at the point of connection. (read more)
Interplex Etch Logic provides high-strength metal filters and metal filtration screens with consistent open-area. The company offers a variety of filtration solutions and technology to the industry.
Our filtration products are used successfully worldwide in thousands of demanding applications. Interplex Etch Logic provides expert technical assistance in designing stainless and oth... (read more)
Interplex Etch Logic's Reel-to-Reel Chemical Etching process is capable of developing sharp point combinations that are suitable for many intended automotive applications.
- High-speed reel-to-reel etching;
- Suitable for other reel-to-reel processes such as forming, plating and insert molding;
- Performed in an ISO/TS 16949 facility
Interplex's SMT Card-Edge contacts can be placed on a daughter card using standard high-speed pick and place surface mount equipment. The Surface Mount Device (SMD) solder interface utilizes pin in paste through-hole technology as well as recessed channels for improved solder distribution which allows for high mechanical strength at the point of connection. (read more)
