Interplex Industries, Inc.
Interplex's application specific solutions for the packaging of IGBT power modules and complete power stack assemblies utilizing several proven core high-force, high-power, pluggable interconnect technologies, such as press-fit, IDC (Insulation Displacement Connectors), tuning forks and other products to improve power module packaging efficiency.(read more)
Learn about Interplex's solder and flux bearing lead technology (SBL), a technology that has been deployed across a wide spectrum of product designs and applications. Virtually any arena that requires the joining of metal parts via solder is a candidate application for integrating the solder within one of the components.(read more)
Interplex's Surface Mount Technology (SMT) Card-Edge contacts are placed on a daughter card using standard high-speed pick and place surface mount equipment. The Surface Mount Device (SMD) solder interface utilizes pin in paste through-hole technology as well as recessed channels for improved solder distribution. Together, they make a high-strength electrical/mechanical connection.(read more)
This Interplex Press-Fit Tech Bulletin discusses the current carrying capacity, especially in high-power applications.
The specific three topics in this series are:
• Application requirements for higher current capabilities
• Current capability testing and results
• Special design considerations for power module applications.(read more)
Interplex Etch Logic's Reel-to-Reel Chemical Etching process is capable of developing sharp point combinations that are suitable for many intended medical applications.
Strong, sharp tapered points are ideal for even the most difficult punctures and small incisions.
IDC Terminals: Insulation Displacement Connectors and Components (IDC) and Magnet Wire Terminals
Interplex developed and designed its new IDC family of magnet wire terminals to work directly with heavier, multi-layer magnet wire coatings while maintaining a high normal force and a low contact resistance. These terminals were designed to support the high-power and harsh environment...(read more)
With a rapidly expanding range of industries now relying on solder-free Press-Fit technology as a key lynchpin in their electronics assembly strategies, it has become increasingly important for suppliers of compliant Press-Fit interconnects to provide stringently controlled testing, qualification and manufacturing processes.(read more)
Interplex Etch Logic provides high-strength metal filters and metal filtration screens with consistent open-area. The company offers a variety of filtration solutions and technology to the industry.
Our filtration products are used successfully worldwide in thousands of demanding applications. Interplex Etch Logic provides expert technical assistance in designing stainless and oth...(read more)
Interplex's reel-to-reel chemical etching process creates consistent, repeatable high-strength metal filters by controlling 160 process parameters including the chemistry, temperature, exposure.(read more)
Driven by the explosive growth of automotive electrical systems and many other industries using inverter and converter based power modules, press-fit technologies have become the preferred alternative for delivering highly reliable, solderless interconnect solutions.(read more)
Interplex Etch Logic's Reel-to-Reel Chemical Etching process is capable of developing sharp point combinations that are suitable for many intended automotive applications. High-speed reel-to-reel etching; Suitable for other reel-to-reel processes such as forming, plating and insert molding; Performed in an ISO/TS 16949 facility(read more)
Interplex's SMT Card-Edge contacts can be placed on a daughter card using standard high-speed pick and place surface mount equipment. The Surface Mount Device (SMD) solder interface utilizes pin in paste through-hole technology as well as recessed channels for improved solder distribution which allows for high mechanical strength at the point of connection.(read more)
Wire-bondable plating is a key process step in the manufacturing of all types of semiconductor packages including Integrated Connector Package Modules such as MEMS housings, sensors, LEDs, and Solar and Power Electronic modules. Successful bonding of aluminum or gold wire to an interconnect module lead-frame requires a plated surface with the highest level of material surface quality.(read more)
Integration of RF shielding is a critical issue for many products, especially in compact mobile handheld devices with increasingly complex circuitry and very thin PCBs. To prevent problems such as shield pop-up and signal leakage, many manufacturers use costly secondary soldering processes.(read more)