Master Bond, Inc. - No-Mix Glob Top Adhesive and Sealant

Master Bond Supreme 3HTND-2GT is a fast curing, toughened, one component epoxy adhesive and sealant ideal for precise positioning and bonding of microelectronic components and other electronic assemblies. It offers remarkably durable protection against adverse environmental conditions, vibration, impact and thermal shock for components on circuit boards. (read more)

Master Bond, Inc. - Electrically Conductive Coating System

Ideal for electromagnetic interference and radio frequency interference shielding applications, MB600G is an aqueous based, sodium silicate system with a graphite filler. Graphite filled materials are widely used for shielding and static dissipation applications because of their balance of shielding effectiveness and cost. (read more)

Master Bond, Inc. - Toughened, High Performance Encapsulation Compound

Featuring a low viscosity, EP38CL is an optically clear two component epoxy that is used for bonding, sealing, coating and encapsulation in optical, aerospace, opto-electronic and specialty OEM applications. It possesses superior impact resistance, thermal cycling capabilities as well as the ability to withstand mechanical shock better than typical epoxies that are higher on the Shore D... (read more)

Master Bond, Inc. - Versatile, Optically Clear Two Part System

With a glass transition temperature exceeding 175°F, EP30-3LO combines superior chemical resistance along with passing NASA low outgasing testing requirements. It has an easy to use 100 to 30 mix ratio by weight, and while it requires heat curing, it offers a long open time of 6-10 hours. It bonds well to a wide variety of substrates. (read more)

Master Bond, Inc. - Condensation Curing Silicone Is Optically Clear

Low viscosity MasterSil 152 is a two component silicone system that cures when exposed to air at room temperature. It has an exceptionally low viscosity and outstanding electrical insulation properties, making it ideal for potting and encapsulation applications. (read more)

Master Bond, Inc. - Abrasion Resistant Epoxy Adhesive

Featuring an array of rough and tumble performance properties, Master Bond EP21SC-1 is ideal for chemical and mechanical processing applications as well as tank and chute maintenance. This exceptionally rigid material has a Shore D hardness exceeding 95. EP21SC-1 includes a silicon carbide filler which enhances its abrasion resistance. It also withstands a wide variety of chemicals. (read more)

Master Bond, Inc. - Flame Resistant Epoxy System

Featuring a non-halogenated filler, EP21FRNS-2 is a two component, room temperature curing epoxy offering low smoke generation for potting, encapsulating and casting applications. As per the UL 94V-0 specification, this system is serviceable over the wide temperature range of -60°F to 200°F. It is remarkably resistant to thermal cycling and many chemicals. (read more)

Master Bond, Inc. - EP112LS: Ideal for Impregnation Applications

EP112LS is optically clear, features reliable non-yellowing properties and has a refractive index of 1.55. This electrically insulative system is resistant to chemicals including water, oils, fuels, acids and bases. Featuring a mixed viscosity of 50-200 cps, EP112LS is serviceable over the temperature range of -60°F to +450°F. (read more)

Master Bond, Inc. - Quartz Filled, Heat Resistant Epoxy

Suitable for applications where long-term exposure to a broad range of temperatures from -60°F to +450°F is required, Supreme 45HTQ is a toughened, quartz filled system. It produces durable high strength bonds which have a superior ability to withstand thermal cycling and chemicals. (read more)

Master Bond, Inc. - Epoxy for Indirect Food Applications

Featuring a convenient one to one mix ratio by weight or volume, EP21NDFG is a two component epoxy with a paste consistency. This room temperature curing system offers outstanding physical properties including dimensional stability, thermal cycling resistance and electrical insulation values. It withstands a wide variety of chemicals, including water, oils, fuels, acids, bases and salts. (read more)

Master Bond, Inc. - Epoxy with Glass Transition Temperature Over 215°C

With exceptional thermal conductivity and electrical insulation properties, EP46HT-1AO is a two component epoxy for high performance bonding and sealing applications. This high temperature resistant system cures readily with heat and offers a long open time at room temperatures. It provides noteworthy dimensional stability, chemical resistance and physical strength properties. (read more)

Master Bond, Inc. - Urethane Modified Epoxy Gel System

Master Bond Super Gel 9 cures readily at room temperature to form a soft, resilient, gel-like system with excellent dimensional stability. Extremely low viscosity and exotherm enable it to be cast in larger sections up to 2-3 inches thick. Super Gel 9 is deal for use in a variety of applications, especially the encapsulation of sensitive electronic parts and sealing delicate optical comp... (read more)

Master Bond, Inc. - High Performance LED Curable Compound

Master Bond LED401 is a unique single component compound that cures rapidly upon exposure to 405 nm light. This formulation has a low viscosity, high bond strength and superior electrical insulation properties. (read more)

Master Bond, Inc. - High Viscosity Medical Grade Compound

UV10TKMed is USP Class VI approved and meets ISO 10993-5 for cytotoxicity requirements. It is used in the assembly of medical devices and is capable of withstanding repeated sterilizations, including radiation, ethylene oxide, chemical sterilants and especially autoclaving. This higher viscosity, one part system has exceptionally good optical clarity. (read more)

Master Bond, Inc. - Biocompatible, Addition Cured Silicone

Formulated for medical device applications, MasterSil 153Med passes USP Class VI and ISO 10993-5 testing. This two component, addition cured system does not require exposure to air for complete cross-linking. With a convenient one to one mix ratio by weight, it will not outgas while curing. (read more)

Master Bond, Inc. - UV25: Glass Transition Temperature >180°C

UV25 offers exceptional thermal stability over the broad service temperature range of -60°F to +500°F. This one part, moderate viscosity UV curable system bonds well to glass, surface treated metals and plastics such as polycarbonates and acrylics, among others. Additionally, this material is optically clear with a refractive index of 1.55 at room temperature. (read more)

Master Bond, Inc. - Toughened B-Staged Adhesive Film

Master Bond FLM36 is a film adhesive featuring excellent thermal conductivity and electrical insulation properties. FLM36 retains high physical strength properties at temperatures up to 500°F, while combining enhanced thermal and mechanical shock resistance and thermal cycling capabilities. It differs from other heat resistant epoxies due to its toughness. (read more)

Master Bond, Inc. - Flexibilized One Part Epoxy Adhesive and Sealant

Master Bond Supreme 10HTFL features a unique blend of physical properties including outstanding peel strength, very high shear strength and a wide service temperature range of 4K to +350°F making it suitable for cryogenic applications. Supreme 10HTFL features highly desirable handling properties including no mixing and unlimited working life at room temperature. (read more)

Master Bond, Inc. - High Peformance Electrically Conductive Epoxy

Two Component, Silver Coated Nickel Filled Epoxy for High Performance Bonding, Coating and Sealing Featuring Low Volume Resistivity, High Flexibility, Convenient Handling and Cost Effectiveness... (read more)

Master Bond, Inc. - Fast Curing Epoxy System

Master Bond Supreme 33CLV is an adhesive/sealant featuring resistance to elevated temperatures, thermal cycling and chemicals. It produces high strength bonds and is serviceable from -80 to +425°F. (read more)

Master Bond, Inc. - UV22- Nanosilica Filled Reinforced Epoxy System

A nanosilica filled UV curable epoxy called UV22 has been developed for coating, sealing and encapsulation applications. It features abrasion resistance, low shrinkage, high tensile strength, and a glass transition temperature far higher than traditional UV systems. Despite the high percentage of nanoparticles it retains high transparency due to the agglomerate-free colloidal dispersion. (read more)

Master Bond, Inc. - Toughened Structural Adhesive

Formulated for structural applications in extreme environments with temperatures from -80 to +425°F, Master Bond Supreme 33 has superior resistance to thermal cycling, thermal shock and impact. This toughened, two-component epoxy offers high structural bond strength to a wide variety of substrates including metals, glass, ceramics, wood, vulcanized rubbers and many plastics. (read more)

Master Bond, Inc. - High Temperature Resistant Epoxy

Master Bond Supreme 11AOHT is a two component room temperature curing epoxy adhesive with high thermal conductivity and excellent electrical insulation properties. Supreme 11AOHT is a paste that can be applied without sagging or dripping even on vertical surfaces. It has a convenient mixing ratio of 1 to 1 by weight or volume and a service operating temperature range of -100°F to +400°F. (read more)

Master Bond, Inc. - New Epoxy Serviceable At Cryogenic Temperatures

Master Bond Inc. has introduced a new two component epoxy adhesive/sealant for cryogenic applications. Called EP29LPSP, this compound is able to withstand temperatures as low as 4K. Additionally, it is able to resist cryogenic shocks (i.e. room temperature down to liquid helium temperatures in a 5-10 minute time period). (read more)

Master Bond, Inc. - Tough Epoxy Meets NASA Low Outgassing Requirements

Resistance to impact, thermal shock, vibration and stress fatigue cracking is of vital importance in the aerospace, optical, medical and oil/chemical processing industries. Master Bond Polymer Adhesive Supreme 10AOHT-LO is a single component, no mix, thermally conductive compound featuring superior electrical insulation and toughness. (read more)