Master Bond epoxy adhesive EP31 is designed specifically for high performance applications. This two component epoxy features lap shear strengths exceeding 4,500 psi and peel strengths greater than 40 pli. (read more)
For bonding, sealing, coating and formed-in place gaskets, this flexible compound has ultra high temperature resistance. MasterSil 800 has outstanding electrical insulation and is serviceable over the exceptionally broad temperature range of -75°F to +572°F (300°C). This self leveling silicone bonds well to a wide variety of substrates, including glass, metals and many plastics. (read more)
Master Bond Supreme 33CLV is an adhesive/sealant featuring resistance to elevated temperatures, thermal cycling and chemicals. It produces high strength bonds and is serviceable from -80 to +425°F. (read more)
Master Bond EP21TCHT-1 is a heat resistant polymer system formulated for high performance bonding and sealing applications. It features high thermal conductivity and superior electrical insulation properties with a service operating temperature range of 4K to 400°F. EP21TCHT-1 is NASA low outgassing certified and is therefore highly recommended for use in vacuum environments. (read more)
Master Bond EP30-1 is an optically clear epoxy designed for high performance fiber optics bonding, coating, and potting applications. This low viscosity, two part epoxy cures at room temperature or more rapidly at elevated temperatures. High strength bonds exhibits superior dimensional stability and a low-0.0003 inches/in linear shrinkage and a spectral transmittance of over 97%. (read more)
Master Bond EP65HT-1, a two component, NASA low outgassing epoxy adhesive features a unique combination of ultra fast cures, high temperature resistance, excellent physical strength properties…
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A nanosilica filled UV curable epoxy called UV22 has been developed for coating, sealing and encapsulation applications. It features abrasion resistance, low shrinkage, high tensile strength, and a glass transition temperature far higher than traditional UV systems. Despite the high percentage of nanoparticles it retains high transparency due to the agglomerate-free colloidal dispersion. (read more)
Formulated for structural applications in extreme environments with temperatures from -80 to +425°F, Master Bond Supreme 33 has superior resistance to thermal cycling, thermal shock and impact. This toughened, two-component epoxy offers high structural bond strength to a wide variety of substrates including metals, glass, ceramics, wood, vulcanized rubbers and many plastics. (read more)
Need a very flexible epoxy resin system for high performance bonding, sealing, and coating? Master Bond Polymer System EP21TDC-4 has a high peel strength of >30 pli and an elongation of over 300%. It adheres well to untreated rubber materials and rubber compounds that normally require time consuming surface preparation. (read more)
Master Bond EP79 is your answer to a cost effective alternative to silver filled epoxies. Its silver coated, nickel filler translates into exceptionally low electrical resistance. Combine that with optimal adhesive bonding, advanced thermal and wear performance, and excellent physical properties and you have an epoxy that's another Master Bond winner. (read more)
Master Bond Supreme 11AOHT is a two component room temperature curing epoxy adhesive with high thermal conductivity and excellent electrical insulation properties. Supreme 11AOHT is a paste that can be applied without sagging or dripping even on vertical surfaces. It has a convenient mixing ratio of 1 to 1 by weight or volume and a service operating temperature range of -100°F to +400°F. (read more)
A tough epoxy potting and encapsulation compound called EP30FL has been introduced by Master Bond Inc. It has extraordinarily low viscosity, is easy to apply and can be used in both thick and thin cross sections. This compound is 100% reactive and generates low exotherm during cure even though it cures relatively quickly at room temperature. Shrinkage upon cure is exceptionally low. (read more)
Master Bond Inc. has introduced a new two component epoxy adhesive/sealant for cryogenic applications. Called EP29LPSP, this compound is able to withstand temperatures as low as 4K. Additionally, it is able to resist cryogenic shocks (i.e. room temperature down to liquid helium temperatures in a 5-10 minute time period). (read more)
Resistance to impact, thermal shock, vibration and stress fatigue cracking is of vital importance in the aerospace, optical, medical and oil/chemical processing industries. Master Bond Polymer Adhesive Supreme 10AOHT-LO is a single component, no mix, thermally conductive compound featuring superior electrical insulation and toughness. (read more)
For outstanding, high performance bonding strength to both similar and dissimilar substrates, Master Bond Polymer Supreme 46HT-2 was developed. This two component adhesive features high temperature resistance along with superior toughness and strength. It has excellent durability, thermal cycling and shock capabilities, as well as superb electrical insulation properties. (read more)
Master Bond EP17HT-3 sets up in 20 to 30 seconds and snap cures in only 2 to 3 minutes at 250°F–300°F. As a one part system, no mixing is required and the epoxy can be cured in sections up to 1/4" thick. Moreover, its working life is indefinite as it will not gel until heated above 200°F. With a volume resistivity of greater than 1014 ohm-cm, EP17HT-3 has excellent elect... (read more)
Master Bond UV10TKLO-2 is a one component, high viscosity, UV curable polymer system that offers optical clarity, high physical strength properties and outstanding chemical resistance. It has passed the rigorous tests to meet low outgassing specifications as per NASA ASTM E-595. (read more)
Featuring a set time as short as 10-15 minutes, Master Bond's medical adhesive EP41SMED forms rigid bonds that are highly resistant to cold sterilants such as ETO and gamma radiation. This system is solvent and diluent-free and fully complies with the testing requirements for USP Class VI. It offers excellent adhesion to a wide variety of similar and dissimilar substrates. (read more)
Silver-filled EP21TDCS-Med meets USP Class VI requirements and is widely used where biocompatibility is of paramount importance. The resistance is exceptional, less than 1 milliohm-cm. It has excellent bond strength (>1,000 psi) and is easy to handle with a 1:1 mixing ratio. (read more)
Master Bond EP24AN is a fast curing two part epoxy; it will cure at temperatures as low as 20°F. It produces high strength bonds to a wide variety of substrates. Having a high thermal conductivity, it also features superior electrical insulation properties, enhanced dimensional stability high tensile shear strength. Temperature service range is -60° to +250°F. (read more)
Master Bond's UV14-3 UV cure adhesive is designed for temporary bonding applications. It offers excellent vibration and shock resistance as well as resistance to thermal cycling and thermal shock. Disassembly can be easily accomplished upon exposure to most conventional solvents such as acetone, MEK, etc. (read more)
Master Bond's USP Class VI certified EP42HT‑2ND2 medical adhesive has a paste like consistency and facilitates the adhesive's application when bonding vertical surfaces. It cures readily at ambient temperatures and exhibits superior thermal stability for service up to 450°F. It forms high strength bonds that are unaffected by sterilization processes. (read more)
Master Bond's FL901AO is a thermal adhesive film, formulated to function as the preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices. It cures quickly at moderate temperatures to a high bond strength, no-mess solution to electronic assembly and other industrial operations. (read more)
Master Bond's metal adhesive Supreme10HT, is a heat resistant epoxy, serviceable over the wide temperature range of 4 K to over 400°F. Offering outstanding strength properties for metal bonding, it is resistant to impact, thermal shock, vibration and severe thermal cycling. In many instances it is superior to welding, distributing stress loads over a broad area thereby reducing stress. (read more)
Master Bond EP3HTMED is a fast curing medical adhesive designed to improve the assembly of disposable and reusable medical devices. High strength bonds are resistant to impact, vibration and stress fatigue cracking over a wide service temperature range of -60°F to 400°F. Master Bond's medical adhesive fully complies with USP Class Vl requirements for biocompatibility. (read more)
