Product Announcements


Master Bond, Inc.

Master Bond, Inc. has promoted these products:

Master Bond, Inc. - Epoxy Offers Low Coefficient of Thermal Expansion

Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications. (read more)

Master Bond, Inc. - Epoxy for Die Attach Applications

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for bonding and sealing. (read more)

Master Bond, Inc. - EP39MAOHT: Thermally Conductive Epoxy

Two component, thermally conductive, electrically insulative, room temperature curing epoxy resin system (read more)

Master Bond, Inc. - Two part epoxy system meets Airbus standards

This specialty non-halogenated system can be used for bonding, sealing and encapsulating applications in aircraft . (read more)

Master Bond, Inc. - EP62-1BF: Low Viscosity Epoxy, Chemical Resistance

Master Bond EP62-1BF protects against many aggressive chemicals, even at
elevated temperatures. It is a two component epoxy system that has a very long working life at room temperature and requires curing at moderately elevated temperatures. (read more)

Master Bond, Inc. - Addition Cured Silicone

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. (read more)

Master Bond, Inc. - Low Viscosity, Optically Clear Epoxy Compound

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. It is serviceable over the wide temperature range of -60°F to +250°F. (read more)

Master Bond, Inc. - Non-Drip Epoxy Resists Repeated Sterilizations

Master Bond EP3HTND-2Med Black is a high strength, fast curing epoxy for use in the assembly of medical devices. It fully meets USP Class VI specifications. It is a one part system that combines easy processing with excellent physical strength and bonding properties. This epoxy has a paste consistency and is formulated not to flow while curing. (read more)

Master Bond, Inc. - EP46HT-2AO Black

NASA Low Outgassing Epoxy Has Superior Heat Dissipation Properties (read more)

Master Bond, Inc. - One Part, Thermally Conductive Elastomeric System

Elastomeric adhesive system, X5TC delivers thermal conductivity of 10-12 BTU•in/ft2•hr•°F [1.44-1.73 W/m•K] while maintaining excellent electrical insulation properties. (read more)

Master Bond, Inc. - EP126: Chemical Resistant Epoxy Features High Tg

Widely used in the electronic, aerospace, optical and specialty OEM industries, Master Bond EP126 excels in high temperature applications up to +600°F. (read more)

Master Bond, Inc. - Two component, optically clear epoxy

The most special feature of EP30-2LB is its optical transmission profile. It blocks UV light from 200 nm to about 400 nm and transmits well from 450-900 nm and above. EP30-2LB has a number of other appealing attributes such as its excellent physical strength properties. It is a strong and reliable adhesive. It bonds well to a wide variety of substrates including metals, composites, glass... (read more)

Master Bond, Inc. - EP21TDCN-LO

Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. (read more)

Master Bond, Inc. - Epoxy for Underfill Applications

Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W. (read more)

Master Bond, Inc. - UV22DC80

Master Bond UV22DC80 is a nanosilica filled, dual cure epoxy based system. It is formulated to cure readily upon exposure to UV light and most importantly it will crosslink in shadowed out areas with the addition of heat. (read more)

Master Bond, Inc. - EP29LPAO

Two component, thermally conductive, electrically insulative epoxy system particularly suited for large potting and encapsulation applications (read more)

Master Bond, Inc. - EP3HTS-LO

Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries. (read more)

Master Bond, Inc. - EP113: Nanosilica Filled, Optically Clear Epoxy

Master Bond EP113 is a nanosilica filled epoxy that delivers enhanced dimensional stability and exceptionally low shrinkage upon curing. (read more)

Master Bond, Inc. - MasterSil 910Med

Master Bond MasterSil 910Med is a one part acetoxy type silicone system that meets USP Class VI specifications for biocompatibility and ISO 10993-5 testing for cytotoxicity. This translucent paste also withstands many sterilization methods, including liquid sterilants, gamma radiation and EtO. (read more)

Master Bond, Inc. - Supreme 45HTQ-4

Master Bond Supreme 45HTQ-4 is a two component, toughened, silicon carbide filled epoxy for high performance bonding, sealing and casting. (read more)

Master Bond, Inc. - Supreme 3HTND-2CCM

Master Bond Supreme 3HTND-2CCM is a rapid curing, toughened, multifunctional, one part epoxy system that can be used for bonding, sealing, coating, potting and glob topping. (read more)

Master Bond, Inc. - UV15X-6NM-2: UV Curable System

Master Bond UV15X-6NM-2 is a one component, UV curing urethane acrylate system featuring flexibility, toughness and superior abrasion resistance. (read more)

Master Bond, Inc. - LED Light Curable Adhesives

Visible light curable adhesives feature high bond strength, thermal stability, chemical and water resistance and excellent surface cure. (read more)

Master Bond, Inc. - One Part Silicone Adhesives, Sealants and Coatings

Master Bond produces a large variety of one part, no mix, tin catalyzed RTV silicones. (read more)

Master Bond, Inc. - Room Temp Curing Epoxy Serviceable Up To 400°F

Master Bond EP21TCHT-1 is a heat resistant polymer system formulated for high performance bonding and sealing applications. It features high thermal conductivity and superior electrical insulation properties with a service operating temperature range of 4K to 400°F. EP21TCHT-1 is NASA low outgassing certified and is therefore highly recommended for use in vacuum environments. (read more)

Master Bond, Inc. - Epoxy Adhesive With Very Low Thermal Resistance

Master Bond Supreme 18TC is a cutting edge material pertaining to the thermal management of epoxies. This system utilizes a special blend of highly thermally conductive filler material that is capable of being applied in bond lines as thin as 10-15 microns. Supreme 18TC maintains high bond strength properties even when exposed to hostile environmental conditions, including elevated tempe... (read more)

Master Bond, Inc. - Toughened Epoxy Offers A Long Working Life

Developed for high tech bonding and sealing applications, Master Bond Supreme 11HTLP is a two part epoxy that is often selected for the aerospace, electronics and specialty OEM industries. (read more)

Master Bond, Inc. - Flame Resistant Epoxy System

Featuring a non-halogenated filler, EP21FRNS-2 is a two component, room temperature curing epoxy offering low smoke generation for potting, encapsulating and casting applications. As per the UL 94V-0 specification, this system is serviceable over the wide temperature range of -60°F to 200°F. It is remarkably resistant to thermal cycling and many chemicals. (read more)

Master Bond, Inc. - EP90FR-V: Passes Vertical Burn Test

Formulated for specialty aviation applications, EP90FR-V is a two component epoxy system meeting FAR standard 14 CFR 25.853(a) for flame retardancy. The most noteworthy applications include interior panels, door frame lining and floor/door assemblies. Since it is a superior electrical insulator, it is also a candidate for electronic potting and sealing applications. (read more)

Master Bond, Inc. - EP21AOLV-2Med: Two component epoxy compound

Master Bond EP21AOLV-2Med is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, coating and encapsulant. (read more)

Master Bond, Inc. - Non-Toxic Cyanoacrylate for Bonding Applications

Low viscosity MB250NT is a single component ethyl cyanoacrylate that cures exceptionally fast at room temperature. This high strength, non-toxic system meets ISO 10993-5 standard for cytotoxicity. It is often used in high speed production of disposable medical devices and also has first rate resistance to EtO and gamma sterilization processes. (read more)

Master Bond, Inc. - Supreme 12AOHT-LO: NASA Low Outgassing Adhesive

Cryogenically serviceable Supreme 12AOHT-LO combines superior thermal conductivity with reliable electrical insulation properties in an easy to use, no mix system. (read more)

Master Bond, Inc. - EP3SP5FL: One component “snap cure” epoxy adhesive

Featuring an extraordinary combination of properties, EP3SP5FL is a one component epoxy offering snap cures of 1-2 minutes at 300°F. It has high strength properties, superior electrically insulation and is readily reworkable. (read more)

Master Bond, Inc. - Epoxy system for indirect food applications

Master Bond EP30HV is a lower viscosity, two component epoxy system for high performance bonding, sealing, coating and potting. (read more)

Master Bond, Inc. - Two Part Epoxy with Very Low Exotherm

Suitable for large castings, EP21LVSP6 is a room temperature curing system with a long open time and a low viscosity. This epoxy features a convenient one to one mix ratio and can also be used in bonding, sealing and coating applications. It has very good physical strength properties as well as being an excellent electrical insulator. (read more)

Master Bond, Inc. - Ultra Low Coefficient of Thermal Expansion Epoxy

Master Bond EP42HT-2LTE is widely used for a variety of bonding, sealing, coating and select casting applications in the electronic, aerospace, optical and specialty OEM industries. This two component epoxy has a flowable paste consistency that enables precise alignment with minimal fixturing. It cures at room temperature or more quickly with the addition of heat. (read more)

Master Bond, Inc. - LED Curable System Is USP Class VI Certified

LED403Med is a one part LED system that cures fully upon exposure to a 405 nm wavelength LED light. In thinner sections, cures can be achieved in 15-30 seconds (and even less), while thicker sections require longer cure times. It resists various sterilization methods, and passes the plastics test for USP Class VI biocompatibility and ISO 10993-5 cytotoxicity requirements. (read more)

Master Bond, Inc. - Thermally Conductive, Non-Corrosive Silicone

MasterSil 705TC is a single component thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It cures readily at ambient temperatures when exposed to atmospheric moisture and is a non-corrosive type silicone. This off-white colored paste is reworkable. (read more)

Master Bond, Inc. - UV Curable Compound with a Non-Drip Viscosity

Offering impressive toughness, UV15-42C is a very high strength, one part, translucent adhesive that can withstand thermal and mechanical shocks while retaining excellent dimensional stability. It is a competent electrical insulator and has exceptionally low shrinkage upon curing. UV15-42C is not oxygen inhibited and will cure in thicknesses up to ¼ inch. (read more)

Master Bond, Inc. - Thermally Conductive Silicone

Featuring superb electrical insulation properties Master Bond MasterSil 156 is a two component, low viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, thermal conductivity along with meeting UL 94V-0 for flame retardancy. (read more)

Master Bond, Inc. - Heat Curing, Chemical Resistance Epoxy System

Master Bond’s two component epoxy resin system EP62-1, is widely used for high performance bonding, filament winding, castings and printed circuit board laminates. It offers outstanding resistance to many aggressive chemicals and maintains superior heat resistance throughout its working life. Upon cure, EP62-1 features minimal shrinkage and excellent electrical insulation. (read more)

Master Bond, Inc. - Electrically Conductive Coating System

Ideal for electromagnetic interference and radio frequency interference shielding applications, MB600G is an aqueous based, sodium silicate system with a graphite filler. Graphite filled materials are widely used for shielding and static dissipation applications because of their balance of shielding effectiveness and cost. (read more)

Master Bond, Inc. - Toughened, High Performance Encapsulation Compound

Featuring a low viscosity, EP38CL is an optically clear two component epoxy that is used for bonding, sealing, coating and encapsulation in optical, aerospace, opto-electronic and specialty OEM applications. It possesses superior impact resistance, thermal cycling capabilities as well as the ability to withstand mechanical shock better than typical epoxies that are higher on the Shore D... (read more)

Master Bond, Inc. - Versatile, Optically Clear Two Part System

With a glass transition temperature exceeding 175°F, EP30-3LO combines superior chemical resistance along with passing NASA low outgasing testing requirements. It has an easy to use 100 to 30 mix ratio by weight, and while it requires heat curing, it offers a long open time of 6-10 hours. It bonds well to a wide variety of substrates. (read more)

Master Bond, Inc. - Condensation Curing Silicone Is Optically Clear

Low viscosity MasterSil 152 is a two component silicone system that cures when exposed to air at room temperature. It has an exceptionally low viscosity and outstanding electrical insulation properties, making it ideal for potting and encapsulation applications. (read more)

Master Bond, Inc. - Abrasion Resistant Epoxy Adhesive

Featuring an array of rough and tumble performance properties, Master Bond EP21SC-1 is ideal for chemical and mechanical processing applications as well as tank and chute maintenance. This exceptionally rigid material has a Shore D hardness exceeding 95. EP21SC-1 includes a silicon carbide filler which enhances its abrasion resistance. It also withstands a wide variety of chemicals. (read more)

Master Bond, Inc. - EP112LS: Ideal for Impregnation Applications

EP112LS is optically clear, features reliable non-yellowing properties and has a refractive index of 1.55. This electrically insulative system is resistant to chemicals including water, oils, fuels, acids and bases. Featuring a mixed viscosity of 50-200 cps, EP112LS is serviceable over the temperature range of -60°F to +450°F. (read more)

Master Bond, Inc. - Urethane Modified Epoxy Gel System

Master Bond Super Gel 9 cures readily at room temperature to form a soft, resilient, gel-like system with excellent dimensional stability. Extremely low viscosity and exotherm enable it to be cast in larger sections up to 2-3 inches thick. Super Gel 9 is deal for use in a variety of applications, especially the encapsulation of sensitive electronic parts and sealing delicate optical comp... (read more)

Master Bond, Inc. - High Performance LED Curable Compound

Master Bond LED401 is a unique single component compound that cures rapidly upon exposure to 405 nm light. This formulation has a low viscosity, high bond strength and superior electrical insulation properties. (read more)

Master Bond, Inc. - Toughened B-Staged Adhesive Film

Master Bond FLM36 is a film adhesive featuring excellent thermal conductivity and electrical insulation properties. FLM36 retains high physical strength properties at temperatures up to 500°F, while combining enhanced thermal and mechanical shock resistance and thermal cycling capabilities. It differs from other heat resistant epoxies due to its toughness. (read more)