Technical Articles

Supplier:

Endicott Interconnect Technologies, Inc.


Endicott Interconnect Technologies, Inc. has published these technical articles:

(Desktop Personal Computers)
From this Article:
This client is a leader in the design and development of integrated systems and solutions for advanced missions. These include: unmanned aerial operations, electronic warfare, active electronically... (View Full Article)
(Desktop Personal Computers)
From this Article:
Very high performance computer applications have created a demand for large organic substrates capable of interconnecting one or a few ASIC semiconductor devices with packaged memory devices. The... (View Full Article)
(Desktop Personal Computers)
From this Article:
The reliability of Plated through holes (PTH's) is presented as "PTH life curves" which plot cycle to fail vs. temperature for the entire range of field, accelerated thermal cycling, and assembly... (View Full Article)
(Desktop Personal Computers)
From this Article:
The authors of this paper will describe a method to assist system designers of High Speed Systems in the selection of PWB design / build attributes. The attributes that will be covered are; dielectric... (View Full Article)
(Desktop Personal Computers)
From this Article:
The speed of differential digital signals, such as 12.5 Gb/s, have increased enough to be degraded by semiconductor packaging features which are ignored at lower frequencies. In addition, more and... (View Full Article)
(Desktop Personal Computers)
From this Article:
Electronic Packaging is a critical part of all electronic devices and can be a source of the reliability problems experienced by systems using those devices. In many cases, the packaging defects are... (View Full Article)
(Desktop Personal Computers)
From this Article:
The thermal performance characteristics of organic flip-chip packages (FC-PBGA) incorporating thin (0.5mm), high interconnect density (dense-core) organic substrates has been studied using 1-D... (View Full Article)

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