Technical Articles

Supplier:

Ferro Corporation-Electronic Material Systems


Ferro Corporation-Electronic Material Systems has published these technical articles:

(Industrial Adhesives)
From this Article:
New slurry formulations have been developed for polishing oxide in both shallow trench isolation (STI) and inner layer dielectric (ILD) CMP processes. These formulations use cerium oxide as the... (View Full Article)
(Industrial Adhesives)
From this Article:
In the manufacture of an integrated circuit it is critical to effectively isolate the active areas that form the transistor gates at the device level. The Shallow Trench Isolation (STI) process was... (View Full Article)
(Industrial Adhesives)
From this Article:
As the IC industry progresses through each successive technology node on the ITRS roadmap, to continually produce more demanding devices, new consumable materials are required to realize the high... (View Full Article)
(Material Handling and Packaging Services)
From this Article:
Previous work has demonstrated that Ferro A6M is the proven leader for high frequency, low loss Low Temperature Cofire Ceramic (LTCC) applications where reliable performance is critical. More than one... (View Full Article)
(Industrial Adhesives)
From this Article:
As the IC industry progresses through each successive technology node on the ITRS roadmap, to continually produce more demanding devices, new consumable materials are required to realize the high... (View Full Article)
(Industrial Adhesives)
From this Article:
Using a low defect ceria dispersion as a base material, formulations having drastically different polishing performance have been developed. It is well known that ceria can exhibit high oxide: nitride... (View Full Article)
(Industrial Adhesives)
From this Article:
New slurry formulations are described for both Shallow Trench Isolation (STI) and Inner Layer Dielectric (ILD) CMP applications. These formulations use cerium oxide as the abrasive, since the industry... (View Full Article)
(Industrial Adhesives)
From this Article:
Standard Inner Layer Dielectric (ILD) polishing utilizes an endpoint detection or a fixed time process to determine when to stop polishing. This can create non-uniformities across the oxide surface... (View Full Article)
(Industrial Adhesives)
From this Article:
The shallow trench isolation (STI) process is a key step in the production of leading-edge integrated circuit devices. In this process, silicon dioxide-filled trenches serve to electrically isolate... (View Full Article)
(Industrial Adhesives)
From this Article:
Slurry selectivity has become increasingly more important in the minds of CMP engineers over the last ten to fifteen years. In many ways, the improved natural selectivity properties of ceria drove the... (View Full Article)