(Welding Equipment and Supplies)
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As semiconductor processing has moved to 300mm wafers, the size of deposition targets, including tungsten, tantalum, and molybdenum has grown, and process complexity has increased as well. This added... (View Full Article)
(Metals and Alloys)
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The indium sulfamate plating bath is a common method of depositing pure indium onto conductive metallic surfaces. A relatively common misconception about the bath is that the deposit will have a... (View Full Article)
(Electrical, Optical, and Specialty Materials)
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In this study, the reliability of low Ag SAC alloy doped with Mn (SACM) was evaluated under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions and compared to eutectic... (View Full Article)
(Electrical, Optical, and Specialty Materials)
From this Article:
One of the biggest misconceptions about NanoFoil® is that it is a form of solder. While it may contain a solder coating if specified (usually tin), it is really a heat source.... (View Full Article)
(Metals and Alloys)
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Although many have predicted the demise of through-hole components, they are alive and well with tens of billions assembled each year. In many cases these components are assembled by wave soldering.... (View Full Article)
(Metals and Alloys)
From this Article:
Although many have predicted the demise of through-hole components, they are alive and well with tens of billions assembled each year. In many cases these components are assembled by wave soldering.... (View Full Article)
(Electrical, Optical, and Specialty Materials)
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During 2010, Indium production continued steadily at a rate of about 500 metric tonnes (mt) per year. Production could have been expanded, had there been a need for higher quantities.... (View Full Article)
(Chemicals and Raw Materials)
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Application: A unique property of indium is that it will wet and bond to certain non-metallics such as glass, glazed ceramics, mica, quartz and various metallic oxides.... (View Full Article)
(Chemicals and Raw Materials)
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Many circuit board manufactures are now using double sided printed circuit boards (PCB) that must be reflowed twice. Consequently, component adhesion is a critical issue to ensure all components... (View Full Article)
(Chemicals and Raw Materials)
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This application note will provide easy to follow instructions for converting a SAC387 solder pot to SAC305 without dumping the entire pot.... (View Full Article)
(Metals and Alloys)
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The solidus temperature is defined as the temperature at which the first deviation from the base line appears (Figure 1). The deviation signals that a phase change is taking place. Thus the solidus... (View Full Article)
(Welding Equipment and Supplies)
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In my twenty years in the electronics manufacturing industry, I have heard a lot of claims made about the use of nitrogen in inerted soldering processes: many of them completely wrong. In this paper,... (View Full Article)
(Welding Equipment and Supplies)
From this Article:
Although many predicted the demise of through-hole components, they are alive and well with tens of billions used each year. In mixed SMT/through-hole PCBs, through-hole components, and especially... (View Full Article)
(Electrical, Optical, and Specialty Materials)
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The advent of lead-free soldering presents many manufacturers with the need to wave solder using lead-free alloys. These alloys melt and are soldered at temperatures well above conventional SnPb... (View Full Article)
(Electrical, Optical, and Specialty Materials)
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With the advent of opto-electronic hermetic packages, it has become necessary to significantly reduce, if not eliminate, foreign materials that can cause reliability problems on the optical components... (View Full Article)
(Electrical, Optical, and Specialty Materials)
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Paste hang up is when solder paste adheres to the squeegee blade after lift-up from stencil.... (View Full Article)
(Metals and Alloys)
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The formation of metal oxides on indium is self-passivating. A thickness of 80-100 Angstroms of oxide is all that will form on the surface. Prior to using indium in a sealing or cold welding... (View Full Article)
(Hand, Power and Assembly Tools)
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Common applications, materials that can be bonded, how does it work and is it RoHs compliant... (View Full Article)
(Electrical, Optical, and Specialty Materials)
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Some applications are very sensitive to the use of a flux due to the post reflow residue that may be present. Also, flux may be a problem in a vacuum environment or in an application in which it must... (View Full Article)
(Metals and Alloys)
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The eutectic gold-tin alloy is 80%Au/20%Sn with a eutectic of 280°C (556°F) and is reflowed in a pure nitrogen or forming gas* atmosphere, which forms the "flux", normally onto gold based... (View Full Article)
(Metals and Alloys)
From this Article:
Although lead-free soldering has been main stream in the industry since 2006 with the replacement of the eutectic SnPb system by the SnAgCu system, the development of drop-in lead-free alternatives... (View Full Article)
(Electrical, Optical, and Specialty Materials)
From this Article:
As the electronics industry moves toward miniaturization and multifunction, smaller components with more functions, such as quad-flat no-leads (QFNs) and LGAs, are increasingly used in a variety of... (View Full Article)
(Metals and Alloys)
From this Article:
Fusible alloys are materials that melt at less then 300°F, well below the melting point of tin-lead eutectic solders and SAC alloys. Bismuth is the major component of many of these alloys and... (View Full Article)
(Electrical, Optical, and Specialty Materials)
From this Article:
As a rule, solder pastes and solder flux (tacky flux), be they no-clean (rosin/resin based) or water washable, do not react well to moisture.... (View Full Article)
(Metals and Alloys)
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Indium has the unique ability to cold weld to itself. If the surfaces have been coated with indium (minimum 0.002"-0.003"), they can be joined by following this procedure... (View Full Article)
(Metals and Alloys)
From this Article:
Indium is an ideal material to create a compression seal due to its softness. It remains malleable and ductile even at cryogenic temperatures. Alloys containing high amounts of indium are sometimes... (View Full Article)
(Metals and Alloys)
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When applied as a coating to glass, mylar or other transparent surface, Indium Oxide and Indium-Tin Oxide (ITO) create conductive, highly transparent surfaces which reflect infrared rays while... (View Full Article)
(Electrical, Optical, and Specialty Materials)
From this Article:
Thermal interface materials are useful for a variety of applications, but solder thermal interface materials (sTIM) are especially suited to high-end device cooling. To improve package reliability, it... (View Full Article)
(Metals and Alloys)
From this Article:
Indium and copper diffuse into one another creating brittle intermetallic formations that could cause failures in applications that are sensitive to shock or thermal cycling.... (View Full Article)
(Metals and Alloys)
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Many components and printed circuit boards are plated with varying thicknesses of gold ranging from a fl ash, (10-15 microinches,) to several hundred microinches. To produce an acceptable joint when... (View Full Article)
(Chemicals and Raw Materials)
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In-line equipment is designed to continuously clean large numbers of circuit boards in a short period of time. As the name implies, the washer receives boards by conveyor, from preceding process units... (View Full Article)
(Metals and Alloys)
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Solar PV cell and module manufacturers are looking for new and improved assembly materials and process enhancements to increase throughput, reduce cost, and improve cell efficiency. To reach these... (View Full Article)
(Metals and Alloys)
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No-clean soldering processes dominate the commercial electronics manufacturing world. With the explosion of growth in handheld electronics devices, manufacturers have been forced to look for ways to... (View Full Article)
(Electrical, Optical, and Specialty Materials)
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A typical reflow profile consists of four stages: preheat, soak or dryout, reflow, and cooling. Understanding these four stages is essential when designing an effective thermal profile.... (View Full Article)
(Metals and Alloys)
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Indium, the 49th element, was discovered in Germany in 1863. In 1934, Indium Corporation of America was the first to begin commercial development of indium, and is still the leading refiner,... (View Full Article)
(Chemicals and Raw Materials)
From this Article:
Selection of the appropriate powder size for a specific solder paste application is an elemental step that will ultimately affect the printability of the solder paste with regard to the stencil... (View Full Article)
(Hand, Power and Assembly Tools)
From this Article:
Solder preforms are manufactured solder shapes that come in standard forms such as squares, rectangles, discs, washers and frames. They can also be manufactured with custom geometries. Preforms... (View Full Article)
(Electrical, Optical, and Specialty Materials)
From this Article:
Packaging is a key element in the design of a solder preform. With the proper packaging, preforms can be efficiently introduced into any manufacturing process. It is also essential to the protection... (View Full Article)
(Metals and Alloys)
From this Article:
The explosive growth of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive electrical components. Not too... (View Full Article)
(Metals and Alloys)
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As in all electroplating processes, proper surface preparation prior to actual electroplating of indium is essential to insure adequate adhesion and coverage of the deposited metal. Indium can be... (View Full Article)
(Metals and Alloys)
From this Article:
Electroplating indium onto various materials allows the evaluation of indium's unique properties. For example, two metallic substrates can be electroplated with indium and subsequently bonded together... (View Full Article)
(Chemicals and Raw Materials)
From this Article:
A properly maintained indium sulfamate plating bath contains 30 - 60 grams of indium metal per liter of plating bath solution depending on the solution age. Due to the high value of indium metal and... (View Full Article)
(Chemicals and Raw Materials)
From this Article:
Solder beads are large solder spheres which form aside components during reflow. They are most common with low stand-off resistors and capacitors. Solder balls are small, widely scattered solder... (View Full Article)
(Welding Equipment and Supplies)
From this Article:
Engineers working with LED and D-pak type component-attach are looking for improved assembly materials and process enhancements to increase throughput, reduce cost, and improve product efficiency and... (View Full Article)
(Hand, Power and Assembly Tools)
From this Article:
It is important to start with a level reservoir of paste (or flux) to prepare for component dipping. For manual/ prototype equipment - begin by setting the blade height to 1/3 the sphere diameter of... (View Full Article)
(Electrical, Optical, and Specialty Materials)
From this Article:
Power semiconductor devices are ubiquitous in electronic equipment running over 10Watts. These power devices convert AC to DC, and vice versa; regulate voltage; switch high currents on and off; and... (View Full Article)
(Electrical, Optical, and Specialty Materials)
From this Article:
Solder powder particle size and shape impacts the functionality of solder paste in many ways: printing/dispensing/dipping; solderballing; graping; voiding; tack and so on. For this reason, I just... (View Full Article)
(Hand, Power and Assembly Tools)
From this Article:
This Application Note provides a basic understanding of the soldering process to individuals new to the field of soldering. It is not meant to be an exhaustive treatment of the subject, but simply a... (View Full Article)
(Metals and Alloys)
From this Article:
Pure aluminum and high aluminum alloys quickly form a tenacious, refractory ceramic oxide on the surface that requires special techniques to remove and achieve successful soldering.... (View Full Article)
(Metals and Alloys)
From this Article:
Gold is a noble metal and therefore does not oxidize or tarnish to any appreciable extent. In electronics, this property makes gold suitable for a number of uses, including contacts for switches and... (View Full Article)
(Metals and Alloys)
From this Article:
Nitinol (nickel/titanium alloy) has become an increasingly popular material in the medical industry, largely due to its shape memory characteristics, where it is often used in stents, catheters and... (View Full Article)
(Electrical, Optical, and Specialty Materials)
From this Article:
As semiconductor nodes and die shrink, the number of I/Os will either increase or remain relatively constant, leading to a need for finer pitches. With device-device interconnect pitches shrinking... (View Full Article)
(Metals and Alloys)
From this Article:
Solder preforms are manufactured under clean room conditions and packaged in an inert gas to minimize oxidation. Since no container offers complete isolation from oxygen in ambient air, preforms... (View Full Article)
(Hand, Power and Assembly Tools)
From this Article:
Sufficient thought should be given to the substrate metallizations used in a soldering application to insure adequate wettbility and reliability This Application Note will discuss some of those... (View Full Article)
(Welding Equipment and Supplies)
From this Article:
The elements indium and gallium are key components in the manufacture of products in high volume emerging markets. The strategic nature of these elements, coupled with some published reports... (View Full Article)
(Chemicals and Raw Materials)
From this Article:
There currently are no industry standards for solar metallization paste. The following are test methods that have been adopted by many thin film photovoltaic solar cell manufacturers and are used by... (View Full Article)
(Electrical, Optical, and Specialty Materials)
From this Article:
Pity the copper age smelter of 3000BC. He had to get his wood fire to 1085?C to smelt or melt copper, sometimes he couldn't get that high a temperature. Even when he was successful, his copper didn't... (View Full Article)
(Metals and Alloys)
From this Article:
The advent of the EU's RoHS law has encouraged a significant amount of research to find an alloy, for electronic assembly that will satisfy RoHS's lead-free requirement and have optimum process... (View Full Article)
(Metals and Alloys)
From this Article:
Indium is commonly used in the manufacture of alkaline batteries. Indium functions by coating the individual zinc particles of the cathode with a thin coating of indium metal. When the battery is... (View Full Article)
(Electrical, Optical, and Specialty Materials)
From this Article:
Thermal Interface Materials (TIMs) are used to efficiently transmit heat from an area of high thermal energy to an area of lower thermal energy. These materials are often used to conduct heat away... (View Full Article)
(Welding Equipment and Supplies)
From this Article:
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size, such as a near die size... (View Full Article)
(Hand, Power and Assembly Tools)
From this Article:
For certain soldering applications, flux coated preforms may offer the greatest number of benefits over other more conventional forms of solder. For applications other than active device manufacture,... (View Full Article)
(Electrical, Optical, and Specialty Materials)
From this Article:
Pin transfer is a way of selectively depositing a semi-solid or liquid material (like a solder paste or ball-attach flux) onto a substrate. It is commonly used to apply flux to BGA (ball-grid-array)... (View Full Article)
(Chemicals and Raw Materials)
From this Article:
Inductively Coupled Plasma (ICP) is used to test all metal containing product. The ICP can detect most of the metal, which includes RoHS metals. Pb, Cd, Cr (total) and Hg. PBBs and PBDEs are not... (View Full Article)
(Metals and Alloys)
From this Article:
Void reduction is a critical challenge in modern electronics assembly, especially for bottom terminated components (BTCs) such as QFNs (quad flatpacks no-leads). Excessive voiding inhibits heat... (View Full Article)
(Electrical, Optical, and Specialty Materials)
From this Article:
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size, such as a near die-sized... (View Full Article)
(Electrical, Optical, and Specialty Materials)
From this Article:
This week's topic is both wafer bumping and substrate bumping with solder paste, and the issue of powder size. I've recently been dealing with some issues from customers who are concerned with the... (View Full Article)