Technical Articles

Supplier:

SUSS MicroTec


SUSS MicroTec has published these technical articles:

(Semiconductor Manufacturing Equipment)
From this Article:
Plasma pre-treatment for low-temperature direct wafer bonding is used worldwide in many different applications. In this process the full wafer surface is exposed to the plasma. Recently, a new process... (View Full Article)
(Semiconductor Manufacturing Equipment)
From this Article:
Wafer level bonding utilizing metal based technologies are coming to the forefront of manufacturing methods in numerous 3D integration schemes and advanced MEMS processing. Copper to copper bonding of... (View Full Article)
(Semiconductor Manufacturing Equipment)
From this Article:
There are numerous process integration schemes currently in place for the implementation of 3D-IC. Via first, via middle, via last along with back end of line (BEOL), front end of line (FEOL) and... (View Full Article)
(Semiconductor Manufacturing Equipment)
From this Article:
In this paper, a revolutionary NIL technique, SCIL, and the corresponding tooling solution on SUSS mask aligners has been introduced. The imprints of 2D holes array over 6 inch area in sol-gel and... (View Full Article)