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Technical Articles
A Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly (.pdf)
(Welding Equipment and Supplies)
As semiconductor processing has moved to 300mm wafers, the size of deposition targets, including tungsten, tantalum, and molybdenum has grown, and process complexity has increased as well. This added...
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Achieving a Finer Grain Structure Using the Indium Sulfamate Plating Bath (.pdf)
(Metals and Alloys)
The indium sulfamate plating bath is a common method of depositing pure indium onto conductive metallic surfaces. A relatively common misconception about the bath is that the deposit will have a...
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