Tiny But Mighty Timing, RF and Power Solutions

Featured Product from Abracon, LLC

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Abracon announces the new Tiny but Mighty™ collection that showcases the best solutions for space constrained applications. Market trends continue to push the limits of size and functional density and yesterday’s designs are no longer competitive. Although functional complexity must increase, overall PCB real estate decreases from one generation's designs to the next. Abracon’s family of ultra-compact RF, timing and power passive components provide the smallest footprint while achieving a high functional density.

The Tiny But Mighty™ collection includes compact chip antennas addressing top protocols for wearables and IoT applications that require WiFi, Bluetooth and GPS/GLONASS/BEIDOU connectivity. These parts achieve tiny footprints of 2.0 x 1.25mm with a 0.6mm profile and 3.05 x 1.6mm footprint with a 0.55mm profile.

Crystals in the MHz and 32.768kHz range are also included and available in footprints of 1.2 x 1.0mm with a low 0.35mm max profile. These components provide solutions in IoT and wearable applications requiring the best combination of small size, low 4pF or 5pF CL and low ESR. Miniature oscillators with a 1.6 x 1.2mm footprint and 0.6mm max profile provide the highest accuracy for 32.768kHz achieving +/-10ppm over temperature.

Tiny But Mighty™ features advanced power optimized MEMS clocks with a 1.6 x 1.2mm footprint and a 0.84mm max profile. These MEMS deliver durability and resistance to shock and vibration in the ultra-small space-saving form factors needed for wearable and industrial IoT applications.

The collection of components includes power inductors driving up to 1.45A RMS current in a 1.6 x 0.8mm footprint and a 0.5mm profile. These inductors provide a solution for switch mode power supplies in wearables while reducing heat and extending battery life.


  • Compact Footprint
  • Industry-leading lowest profile
  • Power saving for energy efficient designs


  • IoT
  • Wearables
  • Consumer Medical/Fitness Monitoring
  • AR/VR
  • Drones
  • Financial Payment Access

Key benefits

  • Ideally suited for space-constrained IoT, Wearables & Wireless applications
  • Simultaneously optimized for low plating load & ESR over extended temperature range
  • Enhanced performance for start-up time and power savings with Low Energy SoC’s
  • Low profile ideal for height constrained designs