Flip-Top BGA Sockets Ease Device Test
Featured Product from Advanced Interconnections Corp.
The compact Flip-Top™ Test Socket design matches your device footprint and uses less PC board space than typical test sockets because it requires no external screws, backing plates, or mounting holes in the PCB. The hinged clamp, with integral heat sink, makes insertion and removal of devices quick and easy while ensuring a reliable connection. A chip support plate, customized to your specific IC package, allows for inconsistencies in package coplanarity, thickness, or tolerance issues to ensure a reliable electrical connection.