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Hi-Contact™ Tube Liquid Cold Plates

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Hi-Contact™ Tube Liquid Cold Plates
Boyd's patented Hi-Contact™ technology optimizes the contact area liquid tubes have with a cooling surface to provide the best possible liquid cold plate thermal performance. Our patented geometry used in these designs ensures the most tube-to-plate and tube-to-device contact possible to minimize interface resistance between all contact surfaces. To further increase performance, a thermal epoxy is applied to the tube/plate joint to provide a gap-free thermal interface between the tube and cold plate.

Hi-Contact™ liquid cold plates feature copper or stainless steel tubing mechanically interlocked into aluminum plates. These cost-effective liquid cold plates are designed specifically for low to medium power density applications.

Standard Hi-Contact™ tube liquid cold plates feature a joint-free continuous tube press-fit into an extruded aluminum plate in a variety of passes for various performance levels.

Custom Hi-Contact™ cold plates are available with either continuous tube styles or a manifold style to increase tube density within the liquid cold plate. Manifolds are brazed to tubes and tested for 100% leak-free performance.

View Standard Hi-Contact™ Liquid Cold Plates or contact the Boyd Engineering Team for a custom design for your application.

For help selecting a standard liquid cold plate please try our liquid cold plate selector tool

Liquid Cold Plates
Liquid cold plates are a critical component of a liquid cooling system. Boyd has the broadest range of design and manufacturing liquid cold plate technologies in the industry. Our global capabilities enable the development and production of more efficient and compact cooling for extremely high heat loads while still maintaining design flexibility and reducing costs.


Liquid Cooling
As electronics devices become more powerful, liquid cooling is becoming much more prevalent across most industries as it is the most compact and efficient method for cooling high density heat loads. Liquid cooled thermal management solutions take advantage of liquids’ higher heat capacity to transfer and dissipate heat loads. Liquids can absorb and transport more heat than air, enabling high performance cooling solutions.

Boyd offers liquid solutions at the device, enclosure, or facility level ranging from small off-the-shelf cold plates for testing purposes to complex liquid cooled systems integrating multiple technologies to cool some of the largest data centers in the world. Boyd liquid cooling solutions provide increased efficiency, utilization, energy recovery, and reliability across all system levels.


With more than 90 years of experience, Boyd is a global leader in thermal management and engineered material solutions for the world’s most demanding applications. 

Browse Boyd Thermal Management Solutions