Ultra-Thin, Flexible, Foldable Thermal Management
Featured Product from Boyd Corporation
Boyd is a world leader in designing and manufacturing fully integrated sealing, protection, and thermal solutions for mobile electronics to meet ever-increasing performance requirements. Our world-class expertise, manufacturing, and customer support help reduce design cycle time with rapid prototyping capabilities, assembly time by combining multiple components into a single assembly for final production, and landed costs by decreasing OEM’s managed vendor list. Our ultra-thin, flexible, & foldable thermal management solutions and engineered materials also include display & optically clear adhesives, bezel bonding, ultra-thin vapor chambers, EMI/RFI management, and many more. Visit us at www.boydcorp.com for more information.