Amphenol ICC OSFP Series Connectors

Featured Product from Digi-Key Electronics

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Amphenol ICC’s OSFP series interconnect system has 60 contacts per port with a 0.6 mm contact pitch and eight high speed channels. The OSFP footprint is optimized for signal integrity performance and built for use in high-speed serial applications. The connectors are enhanced for low crosstalk and have ground commoning for resonance dampening. They are also designed for 1U applications. An integrated heat sink is featured on the module side for optimal thermal performance.

Features
  • Enables 25 Gb/s NRZ and 56 Gb/s PAM4 per channel
  • Transmission
  • Compatible with all mating connector and cage configurations including single port, ganged, and stacked
  • System design enables up to 16 W per port independent of cage configuration
  • Advanced internal ground features provide improved crosstalk performance over QSFP28
  • Designed with considerations to support next generation operating speeds: 112 Gb/s PAM4
  • Custom solutions supported
  • RoHS compliant
  • Part of OSFP interconnect system
  • 200 G / 400 G aggregate bandwidth capacity
  • Allows for maximization of linear port-to-port density
  • Allows for use of DAC, short range and long range optical devices without concern for proper heat management
  • Better signal integrity (SI) performance
  • Potential to upgrade to 112 Gb/s PAM4
  • Custom solutions from adapter cables to loopback cables and beyond
  • Cable and connector solutions for copper or optical based applications
  • Environmentally friendly
Applications
  • Communications
  • Cellular infrastructures
  • Network interface cards
  • Data
  • Hubs
  • Switches
  • Storage systems
  • Servers
  • Industrial and instrumentation
  • Test and measurement equipment