3mm Board-to-Board Interconnect
Featured Product from Heilind Electronics, Inc.
Amphenol SV Microwave’s line of 3mm coaxial between board spacing PCB interconnects allows for the lowest stacked height of any board-to-board high frequency coaxial connection system. Amphenol's 3mm board-to-board interconnect product line is ideal for high density stacked and high density multiport applications. Additionally, installation of this line can be accomplished with and without solder.
Features & Benefits
- 3mm board-to-board spacing
- .150” minimum pitch between adjacent connectors
- DC - 40 GHz
- Computer / Datacom / Telecommunications
Embedded application, High density stacked PCB applications, High density multiport applications