3mm Board-to-Board Interconnect

Featured Product from Heilind Electronics, Inc.


Amphenol SV Microwave’s line of 3mm coaxial between board spacing PCB interconnects allows for the lowest stacked height of any board-to-board high frequency coaxial connection system. Amphenol's 3mm board-to-board interconnect product line is ideal for high density stacked and high density multiport applications. Additionally, installation of this line can be accomplished with and without solder.

Features & Benefits

  • 3mm board-to-board spacing
  • .150” minimum pitch between adjacent connectors
  • DC - 40 GHz

Industries

  • Computer / Datacom / Telecommunications

Applications

Embedded application, High density stacked PCB applications, High density multiport applications

Available at Heilind.