Designed for thermal compression bonding processes
Featured Product from Henkel Corporation - Electronics
LOCTITE ECCOBOND NCP 5209
LOCTITE ECCOBOND NCP 5209 (15G
Features and Benefits:
LOCTITE® ECCOBOND NCP 5209 is designed for thermal compression bonding processes in flip chip to laminate assembly. LOCTITE ECCOBOND NCP 5209 is a non-conductive paste adhesive designed for advanced flip chip Cu pillar applications. It is formulated to be pre-applied to the subtrate and provide fluxing activity to allow solder joint formation and bump protection reliability in flip chip bonding processes.
•Excellent protection of electrical joints
•Compatible with small assembly gap and tight pitches
Improving the electronics technologies of today, for the advances of tomorrow
Electronics innovation touches nearly every facet of our lives. We drive hybrid and electric vehicles with advanced driver assistance systems, use smartphones to manage our work and play, see a new world through augmented reality (AR) headsets, enjoy personalized on-screen entertainment while flying in airplanes, and control our living space through connected home devices. Years ago, some of these innovations were only a dream.
Henkel is the premier materials supplier for the electronics assembly and semiconductor packaging industries. Our advanced formulations include a range of products that facilitate electrical interconnect, provide structural integrity, offer critical protection, and transfer heat for reliable performance. We're proud to create products that improve today’s electronic technologies and enable tomorrow’s advances.
Because of the breadth of our materials portfolio, the depth of our application expertise, and the unmatched scope of our global capabilities, the world’s top technology companies—electronics innovators—choose to partner with us.
No matter your challenge, we can help you find a reliable, cost-effective solution, and support you throughout the entire life cycle of your project with a global sales and technical customer service team.