Low Pressure Molding With Great Flexibility

Featured Product from Henkel Corporation - Electronics

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TECHNOMELT PA 6208 is a high performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This product can be processed at low processing pressure due to its low viscosity, allowing encapsulation of fragile components without damage. This material produces no toxic fumes in process and provides a good balance of low and high temperature performance and good adhesion to plastics. TECHNOMELT PA 6208 exhibits great flexibility in applications requiring strain relief and is ideal for encapsulation of heat-producing components.


Your benefits

  • Good for bonding and low pressure moulding
  • Very short open time for high speed production
  • Suitable for a wide range of adhesion
  • Low temperature flexibility
  • Good resistance to oils and temperature extremes