Semi-sintering, silver die attach paste

Featured Product from Henkel Corporation - Electronics

LOCTITE ABLESTIK ICP 9000 is a silver-filled, semi-sintering adhesive specially designed for use in the assembly of high power and high temperature electronic devices. LOCTITE ABLESTIK ICP 9000 is designed to provide high adhesion and low stress which are essential for the thermal and reliability performances of high end power IC packages, SiC power devices, GaAs and GaN die transistors. The thermal performance of this material is comparable to that of a solder paste product.  With robust adhesion on small and medium die sizes, this material offers an open time of up to two hours and void free bond lines, promoting high reliability and manufacturing flexibility.

  • One component
  • Electrically conductive
  • Good electrical stability
  • Good workability
  • Good sintering properties when used on Ag, PPF, Au and Cu substrates
  • High thermal stability
  • High reliability
  • solder replacement