Power Electronics - Reliability Matched Materials
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Power Electronics -Maximized Reliability with Perfectly Matched Materials
Junction temperatures up to 200 °C, durability requirements of more than 10 years, and everything as cost-effective as possible: New applications such as electromobility or renewable energy represent enormous challenges for power electronics devices. Power modules using Wide Band-gap (WBG) silicon carbide (SiC) and gallium nitride (GaN) technologies are being developed to enable higher power densities and switching frequencies. Traditional assembly and packaging materials such as solder are reaching their limits.
Make use of next generation, perfectly matched assembly and packaging materials to maximize the system reliability. View article