Hermetic Electronic Packages that Beat the Heat

Featured Product from Hermetic Solutions Group

The combination of titanium and Mo/Cu or Cu/W is ideal for achieving lightweight, low-coefficient of thermal expansion (CTE), and high-thermal-conductivity electronic packages. Electrical feedthru pins can be hermetically sealed directly into the titanium using the Hermetic Solutions Group's proprietary Kryoflex ceramic to metal seals. Alternately, hermetic connectors made from explosively bonded dissimilar metals can be laser welded into position using state of the art Lasag Laser Welding technology.