Spin-Coating Waferbumping Fluxes - Semiconductors

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Ensuring Pristine Microbumps in Dimensional Devices

WHITE PAPER Summary: Moore's Law, the driving force and sine qua non of the semiconductor industry for the last sixty years, is beginning to slow due to both physical and economic limitations. While advanced transistor technologies such as FinFET are facilitating the downward gate length trend, the ITRS has recognized the importance of so-called "dimensional devices" - i.e., stacked-die and die-on-interposer (2.5D and 3D architectures) - as key enablers of "More than Moore".


Access the full White Paper Authored by: Andy C. Mackie, Maria Durham, and SzePei Lim.

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