Achieving Uniform Solder Bondline Thickness VIDEO

Featured Product from Indium Corporation

Indium Corporation has launched InFORMS® ESM02, a reinforced matrixed solder composite specifically designed to produce consistent bondline thickness for die-level attach applications.

InFORMS® are reinforced solder preforms that help maintain the required bondline and promote good solder wetting. During the soldering process, the copper does not melt, ensuring that the bondline is maintained across the entire solder joint. This results in:

  • Improved mechanical and thermal reliability
  • Uniform bondline thickness
  • Low-voiding performance

Product Advantages

InFORMS® offer dramatically improved handling when compared to conventional solder alloys or indium-based sheets, foilsribbons, or large preform materials. InFORMS® also offer increased tensile and compressive strength via the substrate materials, while retaining the unique attributes of the outer layer metal (e.g., the softness, ductility, and other advantages of indium).

 Until recently, InFORMS® technology was only applied at the baseplate level. New production capabilities have expanded its use to the die-level with a bondline of 50μm. Other benefits of InFORMS® include:

  • Drop-in replacement for other bondline control methods
  • Increased lateral strength
  • Bondline co-planarity
  • Improved thermal cycling reliability
  • Available in ribbon and preforms

Learn more, just watch the video.

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