TRENCHSTOP™ advanced isolation

Featured Product from Infineon Technologies AG

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This new package concept is able to match the highest requirements in terms of performance, design flexibility and ease of handling. By eliminating the need for thermal grease or thermal interface sheets the TRENCHSTOP™ Advanced Isolation is able to deliver at least 35% lower thermal resistivity and at least 10% system cost reduction, helping designers to lower system complexity, development time, and assembling costs.


  • Lower assembly costs
    • No need to use isolation material and thermal grease
    • 35% reduction in assembling time compared to standard TO-247 with Iso-foils
  • Improved reliability
    • Increased yield eliminating misalignments of isolation foils
  • Decreased heatsink size or increased power density
    • Up to 10°C lower Tc compared to standard TO-247 with isolation material
    • Up to 20% Iout increase for higher power output
  • Decreased EMI filter size & decreased system costs
  • Improved reliability
    • Complete manufacturing process control
    • Easy paralleling

Learn more: Product Page and documentation