Sapphire Cutting Drilling, sapphire optics

Service Detail from Jiangyin Deli Laser Solutions Co., Ltd.

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We have developed different sapphire cutting and drilling process for polished and non-polished sapphire substrates. We can supply sapphire micro machining service with a thickness no more than 2mm, and making micro vias, widely apply to sapphire cover glass, wafer substrate, circuit substrate, windows and optics.

Our fabricating ability:

Thickness: 0.1~2mm

Min feature size: 0.01mm

Could be any shapes: circles, triangle, retangle, hexagon, polygon or any shape in CAD

Tolerance: 5~20um depends on dimension