Sapphire Cutting Drilling, sapphire optics
Service Detail from Jiangyin Deli Laser Solutions Co., Ltd.
We have developed different sapphire cutting and drilling process for polished and non-polished sapphire substrates. We can supply sapphire micro machining service with a thickness no more than 2mm, and making micro vias, widely apply to sapphire cover glass, wafer substrate, circuit substrate, windows and optics.
Our fabricating ability:
Min feature size: 0.01mm
Could be any shapes: circles, triangle, retangle, hexagon, polygon or any shape in CAD
Tolerance: 5~20um depends on dimension