PuraTM Silicon Finishing with FlashDry Technology

Product Announcement from MEI, LLC

PuraTM Silicon Finishing with FlashDry Technology-Image

MEI's Pura™ wet processing system for silicon manufacturers achieves ultra-pure levels, dries tiny granular polysilicon material-that prior to now was thought to beimpossible to dry in large quantities-and reduces energy consumption over today's wet processing and drying systems by 70-80% or more. Pura also saves valuable manufacturing floor space by reducing the wet process system footprint by more than 60%

The new Pura wet processing system encompasses MEI's unique process IP (intellectual property) for etching, rinsing, and drying polysilicon, the key ingredient in manufacturing solar cells. Pura includes MEI's patent-pending FlashDry™ cold dry process that eliminates the use of heat for drying polysilicon

Pura targets manufacturing applications where high purity polysilicon and the
ability to process all form factors is required. PV manufacturers often blend very finegranular material with large rock-like chunks to increase the charge weight of the crucibles used to make ingots for solar wafers. Adding the finer material to the crucible maximizes material use and reduces the handling time during this early, pre-wafer stage of solar cell manufacturing.
Pura combines MEI's expertise in wet batch processing to create an ultra-pure
polysilicon product, regardless of form factor, using a unique etch and rinse process combined with the company's new FlashDry cold dry process. The result is less metallic contamination, less oxidation, and a measurably drier product.