ALPHA® HiTech Underfill Epoxy for Chip Packaging
Featured Product from MacDermid Alpha Electronics Solutions
ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with excellent reliability. It also has a good thermal cycling performance because of its low Coefficient of Thermal Expansion.
Learn more about product data and key features.