ALPHA® HiTech Underfill Epoxy for Chip Packaging

Featured Product from MacDermid Alpha Electronics Solutions

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ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with excellent reliability. It also has a good thermal cycling performance because of its low Coefficient of Thermal Expansion.

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