Our Surface Preparation Solutions for both innerlayer and outerlayer cleaning address the challenges confronted by PCB fabricators, including the complex processing of increased layer counts, as well as the demands posed by harsh mechanical cleaning methods.

Innerlayer Processes

As layer counts increase, innerlayers become thinner and more flexible. Scrubbing techniques such as brushing or pumice blasting can stretch the layer. Aggressive mechanical systems create scratches in the surface that lead to dry film lifting and open circuits after etching. As a result, chemical cleaning using a cleaner followed by a microetch has gained wide acceptance. Our innerlayer surface preparation solutions provide optimum surface topography for bonding while minimizing the potential for damage to the thin innerlayer core materials.

Outerlayer Processes

The correct MacDermid Enthone cleaner and microetch combination improves pattern plate yields by the elimination of resist lifting, resist residues and other plating anomalies that are often associated with inadequate cleaning and etching before plating. Depending on the thickness of copper present in the through-hole, the combination of cleaning efficiency and microetch depth can be adjusted to maximize surface preparation without sacrificing direct metallization, electroless or flash plate integrity. Excellent topography provides good bonding behavior under low etch, which enhances the signal integrity and fine line capability.

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