Low Residue Solder Paste for Fine-Pitch Components
Featured Product from MacDermid Alpha Electronics Solutions
ALPHA OM-372 is designed for superior performance on assemblies with ultra-fine pitch components requiring excellent stencil transfer efficiency and high electrical reliability, such as those found in mobile and wearables, computing, and medical assemblies.
Innovative solder paste enabling next generation high density assembly designs.
ALPHA OM-372 provides best-in-class electrochemical reliability on fine pitch, low standoff components, requiring excellent stencil transfer efficiency and high electrical reliability. This paste is formulated to deliver low post reflow residue and >1.66Cpk transfer efficiency process control on fine feature pads, as low as 80x130µm (008004).