Materials for 3D Structural Electronics
Featured Product from MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions, a global leader in electronic materials for assembly and semiconductor packaging, will be presenting “Next Generation Electronic Materials for Structural and 3D In-Mold Electronics” at LOPEC 2021 Virtual Exhibition and Conference on March 25, 2021.
Dr. Nirmalya Kumar Chaki, Manager, Advanced Materials Research will present the latest innovations in Electronic Inks as part of the 3D Structural Electronics Session. His presentation will focus on three main areas: 1) Trends and drivers in formable materials for In-Mold electronics (IME) applications; 2) Performance of Formable Silver and Dielectric Inks; and 3) 3D In-Mold Electronics Technology Demonstrators.
LOPEC will be held from March 23 – March 25, 2021 as a virtual event. To register for the event please visit the LOPEC website. More information about MacDermid Alpha’s solutions for Flexible, Formable and Printed Electronics can be found at MacDermidAlpha.com