Low CTE Epoxy for Precise Alignment

Featured Product from Master Bond, Inc.

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Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses.

It can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required. 

for PRECISE
ALIGNMENT
LOW CTE EPOXY
NASA low outgassing
Per ASTM E595 standards
Electrically insulative
Volume resistivity...