Thermal Bridge Technology for I/O Applications

Featured Product from Mouser Electronics, Inc.

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TE Connectivity's Thermal Bridge Technology for Input/Output Applications offers superior thermal resistance, while not completely relying on high levels of compression to achieve optimal thermal transfer. This technology features better reliability, durability, and easier serviceability. TE Thermal Bridge Technology is ideal for 5G/Wireless, servers, Ethernet SP routing, and high-performance computing.