Video: CFP60 with top side cooling
Featured Product from Nexperia B.V.
Enhancing thermal performance of CFP60 with top side cooling
Sophisticated package technology combined with efficient cooling is a prerequisite when moving to high power density design. This video reviews the results of Nexperia’s top side cooling demonstrator that utilizes the clip-bond FlatPower package CFP60 and the footprint compatible D2PAK.
The clip-bond package stays 34°C cooler or dissipates more power. Watch and find out why!