Video: CFP60 with top side cooling

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Enhancing thermal performance of CFP60 with top side cooling

Sophisticated package technology combined with efficient cooling is a prerequisite when moving to high power density design. This video reviews the results of Nexperia’s top side cooling demonstrator that utilizes the clip-bond FlatPower package CFP60 and the footprint compatible D2PAK. 

The clip-bond package stays 34°C cooler or dissipates more power. Watch and find out why!

Watch the demonstrator video

Read the blog about how copper clip delivers high power rectifiers