8000i Wire Bonder/Ball (Stud) Bumper
Featured Product from Palomar Technologies, Inc
The Palomar 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. Its patented Dual Z-Axis bond head enables very reliable Deep Access wire bond performance. This machine is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs, and high-reliability devices.
Intelligent Interactive Graphical Interface® (i2Gi®) offers the required management for modern wire bonding, from part design and development to process validation and intuitive operations control. i2Gi is implemented on the 8000i Wire Bonder and available as a Bonder Performance Upgrade (BPU) for 8000 Wire Bonders.
The planarBump™ feature, a patented technology that uses gold wire to produce tailless ball bumps, makes the 8000i Wire Bonder suitable for flip chip and other advanced packaging applications. The overall precision of the 8000i Wire Bonder, along with its large work area and its available deep access capability, results in high-yield processing of fine pitch/high wire count applications.
A ball bumper and stud bumper configuration of the 8000i Wire Bonder is a unique feature of this system. The 8000i Wire Bonder is the only available system that can produce co-planarized gold bumps in one step.
Ball Bumping Applications:
- Stacked memory devices internal components, such as DSPs, ASICs, SAW filters, high bright/high power LEDs, and CMOS image sensors
- Automotive assemblies
- Chip on board (COB)
- CMOS camera modules
- Disk drive assemblies
- Display and solar panels
- Fine pitch devices
- Flex circuits
- Large complex hybrids
- Multichip modules (MCMs)
- Specialty lead frames
- System in packages (SIPs)
The 8000i Wire Bonder uses a unique bond-head motion (patented dual Z-axis with linear rotary motion) to form precise gold ball bumps by repeatable, smooth shearing of the wire off the top of the bump without leaving a tail. This provides a consistent formation of flat <20 micron high bumps, thus eliminating the need for a secondary coining process.
Key software features for the 8000i Wire Bonder include adaptive bond deformation, enhanced loop mode, tailless ball bumping and wedge bond emulation (chain bonding). The Palomar Technologies 8000i Wire Bonder can perform stand-off stitch (SOS). SOS is a program that interfaces with users to define a planar bump prior to crescent bond. IC to IC or difficult to bond materials will benefit for this feature.
The 8000i Wire Bonder also features Continuous Bonding Technology, which can load parts onto the wire bonder while it is bonding.