Die Bonder Flexibility for Next Gen Photonics Pkg
Featured Product from Palomar Technologies, Inc
Martyn Davies, New Business Development from Palomar Technologies UK, will present: "Die Bond Flexibility for Next Generation Photonic Packaging" at Photonics + Virtual Conference and Exhibition.
Start the year with a bang and meet Palomar Technologies at Photonics+ Virtual Conference and Exhibition on February 17 & 18th, 2021. PHOTONICS+ Virtual Exhibition and Conference, in partnership with EPIC, is the new digital live event for the photonics industry. EPIC promotes the sustainable development of organizations working in the field of photonics in Europe.
Come join Palomar and listen to our presentation, along with other leaders in the field of photonics.