Palomar 6500 Die Bonder
Featured Product from Palomar Technologies, Inc
The Palomar 6500 high precision component placement Die Bonder is designed for high-speed, fully automated precision component assembly and offers extraordinary micron-level placement accuracy for photonic, wireless, and medical applications. This eutectic and epoxy die bonder has a 1.5µm placement accuracy, making component assembly practical and cost-effective.
A specialized configuration of the 6500 Die Bonder for wafer scale packaging eutectic die bonding is also available.