SST 3190 High Vacuum Wafer Bonder

Featured Product from Palomar Technologies, Inc

More Info Email Supplier Request A Quote

The SST 3190 and 3180 are high vacuum wafer bonders capable of wafer sizes to 6-inch (150 mm) diameter that provides precise automatic control of heating and cooling at temperatures up to 500°C (1000°C optional). Bellows-actuated clamping platens present uniform mechanical bonding forces up to 750 pounds (5,000 pounds optional) to the wafer pair. The 3190 also provides anodic (electrostatic) bonding capabilities with a high-voltage power supply. Vacuum levels below 10-7 Torr are provided by a cryogenic vacuum pumping system.

Wafer Bonding Capabilities:

  • Flip chip solder reflow
  • Solder lid sealing
  • Wafer to wafer bonding using solder, glass, adhesives and direct fusion
  • Silicon to glass wafer bonding
  • Anodic wafer bonding
  • MEMS wafer bonding
  • Pressure sensor bonding
  • Eutectic wafer bonding
  • Uniform thermal heating up to 1000°

Features

The 3180 and 3190 provide precise automatic control of heating and cooling at temperatures up to 500°C (1000 °C optional). Bellows-actuated clamping platens present uniform mechanical bonding forces up to 750 pounds (5,000 pounds optional) to the wafer pair. The 3190 provides anodic (electrostatic) bonding capabilities with a user-selected high-voltage power supply and chamber feed-through. Vacuum levels down to 50 millitorr are provided in the 3180 by a two-stage mechanical pump. Vacuum levels below 1 x 10-6 torr are provided in the 3190 by a cryogenic vacuum pumping system combined with a dry mechanical forepump. Digital vacuum level gauging is provided to monitor and control vacuum levels. Machine control is provided by an embedded control system operating in a Microsoft Windows® environment.