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New FFKM Seal Material for Plasma Processes

Service Detail from Precision Polymer Engineering Ltd.

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Perlast G65HP is a high performance, ultra-high purity perfluoroelastomer (FFKM) that offers excellent resistance to  high concentration fluorine radical plasmas, plus general fluorine and chlorine based processes.

Perlast® G65HP combines a fully fluorinated polymer backbone with a highly fluorinated cross-linking system to provide a material with exceptional resistance to high temperature and aggressive semiconductor processes.

The fully organic structure of the material and extremely low trace metal content helps to eliminate the risk of particle contamination. Its low erosion rate reduces process tool cost of ownership.

Perlast G65HP is ideal for use in wet and dry semiconductor processes including:

  • Plasma Etching
  • Ash/Resist Stripping
  • Cleaning
  • PVD

Perlast G65HP can be molded into O-rings, seals, NW/KF fittings and custom components to suit any application.