QPF4005 and QPF4006 Front End Module

Featured Product from Qorvo

More Info Email Supplier Request A Quote

The QPF4005 is a dual-channel multi-function Gallium Nitride MMIC front-end module targeted for 39GHz phased array 5G base stations and terminals.  For each channel a multi-function MMIC die combines a low noise amplifier, a low insertion-loss high-isolation TR switch, and a high-gain high-efficiency multi-stage PA.

The QPF4005 operates from 37 GHz to 40.5 GHz range. The receive path (LNA + T/R SW) is designed to provide 15dB of gain and a noise figure less than 4.5dB. The transmit path (PA + T/R SW) provides 18 dB of small signal gain and a saturated output power of 2W each channel.

The compact 4.5 mm x 6.0 mm surface mount package configuration is designed to meet the tight lattice spacing requirements and support multi-channel/dual-polarization phased array applications.

The QPF4005 is fabricated on Qorvo's 0.15um GaN on SiC process. It is housed in an air-cavity laminate package with an embedded copper heat slug. The copper slug, coupled with a low thermal resistance die-attach process, allows the QPF4005 to operate at the extreme case temperatures needed in phased array applications.

The QPF4006 is a multi-function Gallium Nitride MMIC front-end module targeted for 39GHz phased array 5G base stations and terminals. The device combines a low noise high linearity LNA, a low insertion-loss high-isolation TR switch, and a high-gain high-efficiency multi-stage PA.

The QPF4006 operates from 37 GHz to 40.5 GHz range. The receive path (LNA+TR SW) is designed to provide 18dB of gain and a noise figure less than 4.2dB. The transmit path (PA+SW) provides 23 dB of small signal gain and a saturated output power of 2W.

The compact 4.5 mm x 4.0 mm surface mount package configuration is designed to meet the tight lattice spacing requirements for phased array applications.

The QPF4006 is fabricated on Qorvo’s 0.15um GaN on SiC process. It is housed in an air-cavity laminate package with an embedded copper heat slug. The copper slug, coupled with a low thermal resistance die-attach process,  allows the QPF4006 to operate at the extreme case temperatures needed in phased array applications.

For additional information on GaN thermal performance refer to the following application note and video.