Recently we have been working with many of our valued customers and have completed the qualification test of the CPU cooler for AMD Ryzen™ Embedded V1000 FP5 processor family in many computer industrial applications. Please refer to below information.

- AMD FP5 Processor 
The AMD Ryzen™ Embedded V1000 processor family brings together the breakthrough performance of the pioneering AMD “Zen” CPU and “Vega” GPU architectures in a seamlessly integrated SOC solution that sets a new standard in processing power for next-generation embedded designs. Delivering superior graphics and multimedia processing, and compute performance up to 3.6 TFLOPS with thermal design power (TDP) as low as 12W and as high as 54W, AMD Ryzen™ Embedded V1000 SOCs equip system designers to achieve new levels of processing efficiency and design versatility. With a comprehensive set of advanced, integrated security features, AMD Ryzen™ Embedded V1000 SOCs enable sophisticated system protections complemented by an expansive breadth of I/O interconnect options. 

- Rego Cooler Specification 
RG1100B-EAC(H23)-EF5173-28 ( Three positions connector )
RG1100B-EAC(H23)-EF5174-28 ( Four positions connector – PWM Control )
Outline Dimension : 60 x 60 x 33mm
Heat Sink : Extruded AL6063+C1100, ø60 x 22.6mm
Fan : 50 x 50 x 10 mm, dual ball bearing 
Connector Type : 3 way / 4 way (PWM Control)
Thermal Resistance : 0.61 °C/W

RG1100B-EAC(H23)-AD5273-28 ( Three positions connector )
RG1100B-EAC(H23)-AD5274-28 ( Four positions connector – PWM Control )
Outline Dimension : 60 x 60 x 43mm
Heat Sink : Extruded AL6063+C1100, ø60 x 22.6mm
Fan : 50 x 50 x 20 mm, dual ball bearing 
Connector Type : 3 way / 4 way (PWM Control)
Thermal Resistance : 0.57 °C/W