Socket H LGA1155, 1150, 1156 Coolers

Featured Product from Rego Electronics Inc.


Product Series -
1U & 2U Coolers, TDP : 65 Watts to 150 Watts

Features & Benefits -
A full range of products, high quality, high reliability, lower noise level, long term supply, customization available

Target Market -
Server-grade IPC, Point of Sale, Embedded Board, Gaming, Kiosk, Digital Healthcare

CPU Coolers for Intel® Sockets 1155 / 1156 / 1150 CPU

Part Number : RG3114-BF(Z)
Solution : Rugged Computer with 1U Chassis
CPU Socket : 1155 /1156 /1150
Outline Dimension : 90 x 90 x 27.5mm
Noise Level : 59 dB(A)
Connector Type : 2543-4P
Thermal Resistance : 0.39 °C/W
Weight : 330 g

Part Number : RG3114(Z)
Solution : Rugged Computer with 1U Chassis
CPU Socket : 1155 /1156 /1150
Outline Dimension : 90 x 90 x 22.5mm
Noise Level : 46 dB(A)
Connector Type : 2543-4P
Thermal Resistance : 0.45 °C/W
Weight : 310 g

Part number : RG3223
Solution : 2U&Up Server
CPU Socket : 1155/1156/1150
Outline Dimension : 90.75 x 89.50 x 65.25mm
Heat Sink : 78.0 x 62.5 x 61.6mm, Copper Base & Aluminum Fins with Heatpipes embedded
Fan : 60 x 60 x 25 mm, Two Ball Bearing, Manufacturer : Sanyo Denki
Connector Type : 4 ways (PWM Function)
Thermal Resistance : 0.18 °C/W ( TDP(max) : 150 watts )
Noise Level : 44 d B(A)

Socket H LGA1155, 1150, 1156 Coolers_RG3120

Outline Dimension : 87.6 x 81.0 x 27 mm
Heat Sink : Skived C1100, 83 x 81 x 12 mm
Blower : 80 x 80 x 15 mm, Two Ball Bearing, 6000 RPM, Noise Level : 55.8 dB(A)
Connector Type : 2510-4P
Thermal Resistance : 0.30 °C/W
Weight : 380 g

Socket H LGA1155, 1150, 1156 Coolers_RG3121-P

Outline Dimension : 90 x 90 x 25 mm
Heat Sink : Forged AL6063 fins with C1100 Base
Thermal Resistance : 0.25 °C/W @ 800LFM
Weight : 273 g

Socket H LGA1155, 1150, 1156_RG3212 Coolers

Outline Dimension : 92 x 90 x 41.6 mm
Heat Sink : Skived C1100, 90 x 90 x 29 mm
Fan : 70 x 70 x 10.8 mm, Two Ball Bearing, 4300 RPM, Noise Level : 34.5 dB(A)
Connector Type : 2510-3P
Thermal Resistance : 0.31 °C/W
Weight : 626 g

Socket H LGA1155, 1150, 1156 Coolers_RG3220

Outline Dimension : 90.7 x 85 x 64 mm
Heat Sink : Skived C1100 + Stamped AL6063 + Heat Pipe
Fan : Sanyo Denki 60 x 60 x 25 mm, Two Ball Bearing, 5000 RPM, Noise Level : 48 dB(A)
Connector Type : 2510-4P
Thermal Resistance : 0.238 °C/W
Weight : 500 g

Socket H LGA1155, 1150, 1156 Coolers_RG3210

Outline Dimension : 94 x 87.5 x 67.7 mm
Heat Sink : Stamped Aluminum Fin + Heat Pipe
Fan : 77 x 77 x 25 mm, Two Ball Bearing, 4500 RPM, Noise Level : 45.8 dB(A)
Connector Type : 2510-4P
Thermal Resistance : 0.245 °C/W
Weight : 460 g

Socket H LGA1155, 1150, 1156 Coolers_RG3220-P

Outline Dimension : 90 x 90 x 64 mm
Heat Sink : Forged AL6063 fins with C1100 Base
Thermal Resistance : 0.17 °C/W @ 800LFM
Weight : 530 g

Socket H LGA1155, 1150, 1156 Coolers_RG3221

Outline Dimension : 88.5 x 88.5 x 41.5 mm
Heat Sink : Stamped C1100, 88.5 x 88.5 x 20 mm
Fan : 80 x 80 x 15 mm, Two Ball Bearing, 5000 RPM, Noise Level : 46.5 dB(A)
Connector Type : 2510-4P
Thermal Resistance : 0.30 °C/W
Weight : 535 g

Socket H LGA1155, 1150, 1156 Coolers_RG3211

Outline Dimension : 88 x 80 x 36.7 mm
Heat Sink : Extruded AL6063, 88 x 88 x 26.2 mm
Fan : 70 x 70 x 10.5 mm, Two Ball Bearing, 4600 RPM, Noise Level : 34.5 dB(A)
Connector Type : 2510-3P
Thermal Resistance : 0.45 °C/W
Weight : 255 g