Fine Polishing Slurries for Electronic CMP

Product Announcement from Saint-Gobain Surface Conditioning Group

Fine Polishing Slurries for Electronic CMP-Image

Chemical Mechanical Planarization (CMP) has become one of the vital processes in the production of semiconductor devices which use slurries and pads to polish/planarize the surface of wafers to near defect free surfaces.

Saint-Gobain's Polycrystalline Alumina Polishing Slurries are extremely fine particle/slurries intended for semiconductor and electronic materials CMP processes. Products are designated Gen 2, Gen 3, Gen 4, and Gen 5 Polycrystalline Alumina.